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MCR10EZHF9761 Технические параметры

LAPIS  MCR10EZHF9761 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Chip Resistor - Surface Mount
Марка
Package / Case 0805 (2012 Metric)
Supplier Device Package 0805
Material Polyolefin (PO)
Chemical Resistant No
Maximum Operating Temperature + 125 C
Minimum Shrink Temperature + 70 C
Minimum Operating Temperature - 45 C
Factory Pack QuantityFactory Pack Quantity 200
Dielectric Strength 500 V/mil
Inside Diameter 2.6 mm
Part # Aliases 902837J001
Manufacturer TE Connectivity
Brand TE Connectivity / AMP
Recovered Diameter 1 mm
RoHS Details
Maximum Temperature + 125 C
Lead Free Status / RoHS Status Lead free / RoHS Compliant
Other Names RHM9.76KCTR
Series V2
Packaging Spool
Свойство продукта Значение свойства
Operating Temperature -55°C ~ 155°C
Size / Dimension 0.079 L x 0.049 W (2.00mm x 1.25mm)
Tolerance ±1%
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2Terminations
Temperature Coefficient ±100ppm/°C
Type Single Wall
Resistance 9.76 kOhms
Composition Thick Film
Color Black
Power (Watts) 0.125W, 1/8W
Subcategory Wire & Cable Management
Failure Rate -
Product Type Heat Shrink Tubing and Sleeves
Product Tubing
Features -
Product Category Heat Shrink Tubing and Sleeves
Shrink Ratio 2:1
Length 1 m
Height Seated (Max) 0.026 (0.65mm)
Flammability Rating Highly Flame Resistant
Просмотр сходства
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