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MSM5718B70-60GS-K Технические параметры
LAPIS Semiconductor Co Ltd MSM5718B70-60GS-K technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Memory | |
| Марка | ||
| Surface Mount | YES | |
| Material | aluminium | |
| Number of Terminals | 72Terminals | |
| Type of heatsink | extruded | |
| Heatsink shape | round | |
| Material finishing | anodized | |
| Mounting | for back plate | |
| Heatsinks features | LED adapter | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | LAPIS SEMICONDUCTOR CO LTD | |
| Package Description | SSOP, SSOP72,.5 | |
| Clock Frequency-Max (fCLK) | 250 MHz | |
| Number of Words | 2097152 wordsWord | |
| Number of Words Code | 2000000Words Codes | |
| Operating Temperature-Max | 70 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SSOP | |
| Package Equivalence Code | SSOP72,.5 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, SHRINK PITCH |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| JESD-609 Code | e0 | |
| ECCN Code | EAR99 | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| HTS Code | 8542.32.00.02 | |
| Terminal Position | DUAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.635 mm | |
| Reach Compliance Code | unknown | |
| JESD-30 Code | R-PDSO-G72 | |
| Qualification Status | Not Qualified | |
| Temperature Grade | COMMERCIAL | |
| Organization | 2MX9 | |
| Output Characteristics | 3-STATE | |
| Memory Width | 9 | |
| Memory Density | 18874368 bit | |
| I/O Type | COMMON | |
| Memory IC Type | RAMBUS DRAM | |
| Refresh Cycles | 1024 | |
| 2nd Connector Number of Positions Loaded | LED | |
| Length | 0.1m | |
| Diameter | 68.5mm |
Индекс :
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