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TH72016KLD Технические параметры
Melexis Microelectronic Integrated Systems TH72016KLD technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Interface - Telecom | |
| Марка | ||
| Surface Mount | YES | |
| Number of Terminals | 10Terminals | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MELEXIS N V | |
| Part Package Code | QFN | |
| Package Description | HVSON, | |
| Moisture Sensitivity Levels | 1 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HVSON | |
| Package Shape | SQUARE | |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Supply Voltage-Nom | 3 V | |
| JESD-609 Code | e3 |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Terminal Finish | Matte Tin (Sn) | |
| HTS Code | 8542.39.00.01 | |
| Terminal Position | DUAL | |
| Terminal Form | NO LEAD | |
| Peak Reflow Temperature (Cel) | 260 | |
| Number of Functions | 1Function | |
| Terminal Pitch | 0.5 mm | |
| Reach Compliance Code | compliant | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Pin Count | 10 | |
| JESD-30 Code | S-PDSO-N10 | |
| Qualification Status | Not Qualified | |
| Temperature Grade | AUTOMOTIVE | |
| Seated Height-Max | 1 mm | |
| Telecom IC Type | TELECOM CIRCUIT | |
| Length | 3 mm | |
| Width | 3 mm |
TH72016KLD Документы
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