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A2F200M3F-FGG256I Технические параметры

Microchip  A2F200M3F-FGG256I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - System On Chip (SoC)
Марка Microchip
Package / Case FPBGA-256
Surface Mount YES
Supplier Device Package 256-FPBGA (17x17)
Number of Terminals 256Terminals
Typical Operating Supply Voltage 1.5000 V
Device System Gates 200000
Device Logic Gates 200000
Moisture Sensitive Yes
L1 Cache Instruction Memory -
Maximum Clock Frequency 80 MHz
Number of Logic Elements 2000 LELogic Element
Number of I/Os 117 I/OI/O
Maximum Operating Temperature + 100 C
Unit Weight 0.690329 oz
Minimum Operating Temperature - 40 C
Factory Pack QuantityFactory Pack Quantity 90
Mounting Styles SMD/SMT
Number of Logic Array Blocks - LABs -Logic Array Blocks - LAB
Manufacturer Microchip
Brand Microchip Technology / Atmel
Tradename SmartFusion
RoHS Details
L1 Cache Data Memory -
Data RAM Size 64 kB
Package Tray
Base Product Number A2F200
Mfr Microchip Technology
Product Status Active
Package Description 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256
Package Style GRID ARRAY, LOW PROFILE
Moisture Sensitivity Levels 3
Package Body Material PLASTIC/EPOXY
Package Equivalence Code BGA256,16X16,40
Operating Temperature-Min -40 °C
Supply Voltage-Nom 1.5 V
Reflow Temperature-Max (s) 30
Supply Voltage-Min 1.425 V
Operating Temperature-Max 100 °C
Rohs Code Yes
Manufacturer Part Number A2F200M3F-FGG256I
Clock Frequency-Max 80 MHz
Package Code LBGA
Package Shape SQUARE
Part Life Cycle Code Active
Свойство продукта Значение свойства
Ihs Manufacturer MICROSEMI CORP
Supply Voltage-Max 1.575 V
Risk Rank 1.33
Operating Temperature -40 to 100 °C
Series A2F200
Packaging Tray
JESD-609 Code e3
Terminal Finish Matte Tin (Sn)
HTS Code 8542.39.00.01
Subcategory SOC - Systems on a Chip
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Terminal Pitch 1 mm
Reach Compliance Code compliant
JESD-30 Code S-PBGA-B256
Number of Outputs 66Outputs
Qualification Status Not Qualified
Operating Supply Voltage 1.5 V
Power Supplies 1.5,1.8,2.5,3.3 V
Temperature Grade INDUSTRIAL
Operating Supply Current 7 mA
Speed 80MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Program Memory Size 256 kB
Connectivity EBI/EMI, Ethernet, I²C, SPI, UART/USART
Architecture MCU, FPGA
Number of Inputs 66Inputs
Organization 4608 CLBS, 200000 GATES
Seated Height-Max 1.7 mm
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Product Type SoC FPGA
Number of Gates 200000Gates
Speed Grade STD
Primary Attributes ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Number of CLBs 4608CLBs
Number of Logic Cells 4608Logic Cells
Number of Cores 1 CoreCore
Number of Equivalent Gates 200000Equivalent Gates
Flash Size 256KB
Product Category SoC FPGA
Width 17 mm
Length 17 mm
Просмотр сходства
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