Локаль
Язык
- English
- русский
Валюта
- CNY-¥
- RUB-₽
Цена такой валюты может меняться в зависимости от курса только для справки
Корзина для покупок - Все продукты
- /
- Integrated Circuits (ICs)
- /
- Embedded - System On Chip (SoC)
- /
- A2F500M3G-1FGG256I
Есть складские запасы
Min. : 1
Mult. : 1
Mult. : 1
Not available to buy on line? Want the lower wholesale price? Please
sendRFQ, we will
respond immediately
A2F500M3G-1FGG256I Технические параметры
Microchip A2F500M3G-1FGG256I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Embedded - System On Chip (SoC) | |
| Марка | Microchip | |
| Package / Case | 256-LBGA | |
| Surface Mount | YES | |
| Supplier Device Package | 256-FPBGA (17x17) | |
| Number of Terminals | 256Terminals | |
| Number of I/Os | MCU - 25, FPGA - 66I/O | |
| Package | Tray | |
| Base Product Number | A2F500 | |
| Mfr | Microchip Technology | |
| Product Status | Active | |
| Package Description | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256 | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Moisture Sensitivity Levels | 3 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Operating Temperature-Min | -40 °C | |
| Supply Voltage-Nom | 1.5 V | |
| Reflow Temperature-Max (s) | 30 | |
| Supply Voltage-Min | 1.425 V | |
| Operating Temperature-Max | 100 °C | |
| Rohs Code | Yes | |
| Manufacturer Part Number | A2F500M3G-1FGG256I | |
| Clock Frequency-Max | 100 MHz | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Manufacturer | Microsemi Corporation | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Supply Voltage-Max | 1.575 V | |
| Risk Rank | 5.23 | |
| Operating Temperature | -40°C ~ 100°C (TJ) | |
| Series | SmartFusion® |
| Свойство продукта | Значение свойства | |
|---|---|---|
| JESD-609 Code | e1 | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| HTS Code | 8542.39.00.01 | |
| Subcategory | Field Programmable Gate Arrays | |
| Technology | CMOS | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 250 | |
| Terminal Pitch | 1 mm | |
| Reach Compliance Code | compliant | |
| JESD-30 Code | S-PBGA-B256 | |
| Number of Outputs | 66Outputs | |
| Qualification Status | Not Qualified | |
| Power Supplies | 1.5,1.8,2.5,3.3 V | |
| Temperature Grade | INDUSTRIAL | |
| Speed | 100MHz | |
| RAM Size | 64KB | |
| Core Processor | ARM® Cortex®-M3 | |
| Peripherals | DMA, POR, WDT | |
| Connectivity | EBI/EMI, Ethernet, I²C, SPI, UART/USART | |
| Architecture | MCU, FPGA | |
| Number of Inputs | 66Inputs | |
| Organization | 11520 CLBS, 500000 GATES | |
| Seated Height-Max | 1.7 mm | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Speed Grade | 1 | |
| Primary Attributes | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | |
| Number of CLBs | 11520CLBs | |
| Number of Logic Cells | 11520Logic Cells | |
| Number of Equivalent Gates | 500000Equivalent Gates | |
| Flash Size | 512KB | |
| Width | 17 mm | |
| Length | 17 mm |
Индекс :
0123456789ABCDEFGHIJKLMNOPQRSTUVWXYZ