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- A3P250L-FG256I
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A3P250L-FG256I Технические параметры
Microchip A3P250L-FG256I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD) | |
| Марка | Microchip | |
| Surface Mount | YES | |
| Number of Terminals | 256Terminals | |
| Manufacturer Part Number | A3P250L-FG256I | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | BGA, BGA256,16X16,40 | |
| Risk Rank | 7.85 | |
| Clock Frequency-Max | 350 MHz | |
| Moisture Sensitivity Levels | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Nom | 1.2 V | |
| Reflow Temperature-Max (s) | 30 | |
| Supply Voltage-Min | 1.14 V |
| Свойство продукта | Значение свойства | |
|---|---|---|
| JESD-609 Code | e0 | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| HTS Code | 8542.39.00.01 | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 225 | |
| Terminal Pitch | 1 mm | |
| Reach Compliance Code | compliant | |
| JESD-30 Code | S-PBGA-B256 | |
| Number of Outputs | 157Outputs | |
| Qualification Status | Not Qualified | |
| Power Supplies | 1.5/3.3 V | |
| Temperature Grade | INDUSTRIAL | |
| Number of Inputs | 157Inputs | |
| Organization | 6144 CLBS, 250000 GATES | |
| Seated Height-Max | 1.8 mm | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Number of CLBs | 6144CLBs | |
| Number of Logic Cells | 6144Logic Cells | |
| Number of Equivalent Gates | 250000Equivalent Gates | |
| Length | 17 mm | |
| Width | 17 mm |
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