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DS31415GN Технические параметры
Microchip DS31415GN technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Clock/Timing - Application Specific | |
| Марка | Microchip | |
| Package / Case | 2010 (5025 Metric) | |
| Surface Mount | YES | |
| Supplier Device Package | 2010 | |
| Number of Terminals | 256Terminals | |
| Package | Tape & Reel (TR) | |
| Mfr | Vishay Dale | |
| Product Status | Active | |
| Package Description | BGA, | |
| Package Style | GRID ARRAY | |
| Package Body Material | PLASTIC/EPOXY | |
| Operating Temperature-Min | -40 °C | |
| Supply Voltage-Nom | 1.8 V | |
| Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Operating Temperature-Max | 85 °C | |
| Rohs Code | Yes | |
| Manufacturer Part Number | DS31415GN+ | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Manufacturer | Microsemi Corporation | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Risk Rank | 5.81 |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Part Package Code | BGA | |
| Operating Temperature | -65°C ~ 170°C | |
| Series | WSL | |
| Size / Dimension | 0.200 L x 0.100 W (5.08mm x 2.54mm) | |
| Tolerance | ±5% | |
| Number of Terminations | 2Terminations | |
| Temperature Coefficient | ±75ppm/°C | |
| Resistance | 7 mOhms | |
| Composition | Metal Element | |
| Power (Watts) | 0.5W, 1/2W | |
| HTS Code | 8542.39.00.01 | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Number of Functions | 1Function | |
| Reach Compliance Code | compliant | |
| Pin Count | 256 | |
| JESD-30 Code | S-PBGA-B256 | |
| Failure Rate | - | |
| Temperature Grade | INDUSTRIAL | |
| Telecom IC Type | ATM/SONET/SDH SUPPORT CIRCUIT | |
| Features | Automotive AEC-Q200, Current Sense, Moisture Resistant, Pulse Withstanding | |
| Height Seated (Max) | 0.035 (0.89mm) | |
| Ratings | AEC-Q200 |
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