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- M2S010T-VFG400I
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M2S010T-VFG400I Технические параметры
Microchip M2S010T-VFG400I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Embedded - System On Chip (SoC) | |
| Марка | Microchip | |
| Mount | Surface Mount | |
| Package / Case | 400-LFBGA | |
| Surface Mount | YES | |
| Number of Pins | 2Pins | |
| Supplier Device Package | 400-VFBGA (17x17) | |
| Number of Terminals | 400Terminals | |
| Breakdown Voltage / V | 12.2 V | |
| Reverse Stand-off Voltage | 11 V | |
| Number of Elements | 1 Element | |
| RoHS | Compliant | |
| Number of I/Os | 195I/Os | |
| Package | Tray | |
| Base Product Number | M2S010 | |
| Mfr | Microchip Technology | |
| Product Status | Active | |
| Package Description | VFBGA-400 | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Moisture Sensitivity Levels | 3 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Equivalence Code | BGA400,20X20,32 | |
| Supply Voltage-Nom | 1.2 V | |
| Reflow Temperature-Max (s) | 40 | |
| Supply Voltage-Min | 1.14 V | |
| Rohs Code | Yes | |
| Manufacturer Part Number | M2S010T-VFG400I | |
| Package Code | LFBGA | |
| Package Shape | SQUARE | |
| Manufacturer | Microsemi Corporation | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Supply Voltage-Max | 1.26 V | |
| Risk Rank | 5.77 | |
| L1 Cache Instruction Memory | - | |
| Maximum Clock Frequency | 166 MHz | |
| Number of Logic Elements | 12084 LELogic Element | |
| Mounting Styles | SMD/SMT | |
| L1 Cache Data Memory | - | |
| Data RAM Size | 64 kB | |
| Operating Temperature | -40°C ~ 100°C (TJ) | |
| Series | SmartFusion®2 | |
| JESD-609 Code | e1 | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Max Operating Temperature | 150 °C | |
| Min Operating Temperature | -55 °C |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Composition | Zener | |
| HTS Code | 8542.39.00.01 | |
| Subcategory | Field Programmable Gate Arrays | |
| Technology | CMOS | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 250 | |
| Terminal Pitch | 0.8 mm | |
| Reach Compliance Code | compliant | |
| JESD-30 Code | S-PBGA-B400 | |
| Number of Outputs | 195Outputs | |
| Qualification Status | Not Qualified | |
| Operating Supply Voltage | 11 V | |
| Polarity | Bidirectional | |
| Power Supplies | 1.2 V | |
| Leakage Current | 5 µA | |
| Element Configuration | Single | |
| Speed | 166MHz | |
| RAM Size | 64KB | |
| Core Processor | ARM® Cortex®-M3 | |
| Peripherals | DDR, PCIe, SERDES | |
| Power Line Protection | No | |
| Program Memory Size | 256 kB | |
| Connectivity | CANbus, Ethernet, I²C, SPI, UART/USART, USB | |
| Max Reverse Leakage Current | 5 µA | |
| Clamping Voltage | 18.2 V | |
| Architecture | MCU, FPGA | |
| Peak Pulse Current | 82.4 A | |
| Max Surge Current | 82.4 A | |
| Peak Pulse Power | 1.5 kW | |
| Number of Inputs | 195Inputs | |
| Direction | Bidirectional | |
| Test Current | 1 mA | |
| Seated Height-Max | 1.51 mm | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Reverse Breakdown Voltage | 12.2 V | |
| Primary Attributes | FPGA - 10K Logic Modules | |
| Number of Logic Cells | 12084Logic Cells | |
| Number of Cores | 1 CoreCore | |
| Number of Bidirectional Channels | 1Bidirectional Channel | |
| Flash Size | 256KB | |
| Min Breakdown Voltage | 12.2 V | |
| Width | 17 mm | |
| Length | 17 mm | |
| Radiation Hardening | No |
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