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M2S050TS-FGG896I Технические параметры
Microchip M2S050TS-FGG896I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Embedded - System On Chip (SoC) | |
| Марка | Microchip | |
| Lifecycle Status | Production (Last Updated: 2 months ago) | |
| Contact Plating | Lead, Tin | |
| Mount | Through Hole | |
| Package / Case | 896-BGA | |
| Surface Mount | YES | |
| Supplier Device Package | 896-FBGA (31x31) | |
| Number of Terminals | 896Terminals | |
| RoHS | Compliant | |
| Number of I/Os | 377I/Os | |
| Package | Tray | |
| Base Product Number | M2S050 | |
| Mfr | Microchip Technology | |
| Product Status | Active | |
| L1 Cache Instruction Memory | - | |
| Maximum Clock Frequency | 166 MHz | |
| Number of Logic Elements | 56340 LELogic Element | |
| Mounting Styles | SMD/SMT | |
| L1 Cache Data Memory | - | |
| Data RAM Size | 64 kB | |
| Package Description | FBGA-896 | |
| Package Style | GRID ARRAY | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Equivalence Code | BGA896,30X30,40 | |
| Supply Voltage-Nom | 1.2 V | |
| Reflow Temperature-Max (s) | 40 | |
| Supply Voltage-Min | 1.14 V | |
| Rohs Code | Yes | |
| Manufacturer Part Number | M2S050TS-FGG896I | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Manufacturer | Microsemi Corporation | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Supply Voltage-Max | 1.26 V | |
| Risk Rank | 5.82 | |
| Packaging | Tape & Reel (TR) | |
| Operating Temperature | -40°C ~ 100°C (TJ) | |
| Series | SmartFusion®2 | |
| Tolerance | 1 % | |
| JESD-609 Code | e1 |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Number of Terminations | 2Terminations | |
| Temperature Coefficient | 50 ppm/°C | |
| Resistance | 1.62 MΩ | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Max Operating Temperature | 175 °C | |
| Min Operating Temperature | -65 °C | |
| Composition | Metal Film | |
| HTS Code | 8542.39.00.01 | |
| Subcategory | Field Programmable Gate Arrays | |
| Power Rating | 250 mW | |
| Max Power Dissipation | 250 mW | |
| Technology | CMOS | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 250 | |
| Terminal Pitch | 1 mm | |
| Reach Compliance Code | compliant | |
| Military Standard | MIL-R-10509 | |
| JESD-30 Code | S-PBGA-B896 | |
| Number of Outputs | 377Outputs | |
| Qualification Status | Not Qualified | |
| Power Supplies | 1.2 V | |
| Speed | 166MHz | |
| RAM Size | 64KB | |
| Core Processor | ARM® Cortex®-M3 | |
| Peripherals | DDR, PCIe, SERDES | |
| Program Memory Size | 256 kB | |
| Connectivity | CANbus, Ethernet, I²C, SPI, UART/USART, USB | |
| Architecture | MCU, FPGA | |
| Number of Inputs | 377Inputs | |
| Seated Height-Max | 2.44 mm | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Primary Attributes | FPGA - 50K Logic Modules | |
| Number of Logic Cells | 56340Logic Cells | |
| Number of Cores | 1 CoreCore | |
| Flash Size | 256KB | |
| Features | Flame Retardant Coating, Military, Moisture Resistant | |
| Width | 3.68 mm | |
| Length | 8.7376 mm | |
| Diameter | 3.68 mm | |
| Lead Free | Contains Lead |
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