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M2S050TS-VFG400 Технические параметры
Microchip M2S050TS-VFG400 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Embedded - System On Chip (SoC) | |
| Марка | Microchip | |
| Lifecycle Status | Production (Last Updated: 2 months ago) | |
| Mounting Type | Panel Mount | |
| Package / Case | 400-LFBGA | |
| Surface Mount | YES | |
| Supplier Device Package | 400-VFBGA (17x17) | |
| Number of Terminals | 400Terminals | |
| Voltage Rating DC | 28V | |
| Contact Materials | Silver Alloy | |
| Voltage Rating AC | 115V | |
| RoHS | Non-Compliant | |
| Number of I/Os | 207I/Os | |
| Package | Tray | |
| Base Product Number | M2S050 | |
| Mfr | Microchip Technology | |
| Product Status | Active | |
| Package Description | VFBGA-400 | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Moisture Sensitivity Levels | 3 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Equivalence Code | BGA400,20X20,32 | |
| Supply Voltage-Nom | 1.2 V | |
| Supply Voltage-Min | 1.14 V | |
| Operating Temperature-Max | 85 °C | |
| Rohs Code | Yes | |
| Manufacturer Part Number | M2S050TS-VFG400 | |
| Package Code | LFBGA | |
| Package Shape | SQUARE | |
| Manufacturer | Microsemi Corporation | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Supply Voltage-Max | 1.26 V | |
| Risk Rank | 5.82 | |
| L1 Cache Instruction Memory | - | |
| Maximum Clock Frequency | 166 MHz | |
| Number of Logic Elements | 56340 LELogic Element | |
| L1 Cache Data Memory | - | |
| Data RAM Size | 64 kB | |
| Series | 44 | |
| Operating Temperature | 0°C ~ 85°C (TJ) | |
| JESD-609 Code | e1 | |
| Part Status | Active | |
| Number of Positions | 5Positions | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Свойство продукта | Значение свойства | |
|---|---|---|
| HTS Code | 8542.39.00.01 | |
| Subcategory | Field Programmable Gate Arrays | |
| Technology | CMOS | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 250 | |
| Terminal Pitch | 0.8 mm | |
| Reach Compliance Code | compliant | |
| Current Rating | 5A (AC), 1A (DC) | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Contact Finish | -- | |
| Termination Style | Solder Lug | |
| JESD-30 Code | S-PBGA-B400 | |
| Number of Outputs | 207Outputs | |
| Qualification Status | Not Qualified | |
| Actuator Type | Flatted (6.35mm Dia) | |
| Panel Cutout Dimensions | -- | |
| Power Supplies | 1.2 V | |
| Temperature Grade | OTHER | |
| Speed | 166MHz | |
| RAM Size | 64KB | |
| Core Processor | ARM® Cortex®-M3 | |
| Peripherals | DDR, PCIe, SERDES | |
| Program Memory Size | 256 kB | |
| Connectivity | CANbus, Ethernet, I²C, SPI, UART/USART, USB | |
| Number of Decks | 4Decks | |
| Architecture | MCU, FPGA | |
| Number of Inputs | 207Inputs | |
| Operating Force | 5.761 ~ 83gfm | |
| Seated Height-Max | 1.51 mm | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Contact Timing | Shorting (MBB) | |
| Index Stops | Fixed | |
| Circuit per Deck | SP5T | |
| Depth Behind Panel | 52.40mm | |
| Number of Poles per Deck | 1 | |
| Angle of Throw | 45° | |
| Primary Attributes | FPGA - 50K Logic Modules | |
| Number of Logic Cells | 56340Logic Cells | |
| Number of Cores | 1 CoreCore | |
| Flash Size | 256KB | |
| Features | -- | |
| Width | 17 mm | |
| Length | 17 mm | |
| Actuator Length | 11.10mm |
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