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M2S060T-FCSG325 Технические параметры
Microchip M2S060T-FCSG325 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Embedded - System On Chip (SoC) | |
| Марка | Microchip | |
| Lifecycle Status | Production (Last Updated: 2 months ago) | |
| Package / Case | 325-TFBGA, FCBGA | |
| Surface Mount | YES | |
| Supplier Device Package | 325-FCBGA (11x11) | |
| Material | Nylon | |
| Number of Terminals | 325Terminals | |
| Manufacturer Part Number | TY23M-4 | |
| Manufacturer | Thomas & Betts | |
| Typical Operating Supply Voltage | 1.2000 V | |
| Minimum Operating Supply Voltage | 1.14 V | |
| Maximum Operating Supply Voltage | 1.26 V | |
| RoHS | Non-Compliant | |
| Number of I/Os | 200I/Os | |
| Package | Tray | |
| Base Product Number | M2S060 | |
| Mfr | Microchip Technology | |
| Product Status | Active | |
| Package Description | FBGA-325 | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Moisture Sensitivity Levels | 3 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Equivalence Code | BGA325,21X21,20 | |
| Supply Voltage-Nom | 1.2 V | |
| Supply Voltage-Min | 1.14 V | |
| Operating Temperature-Max | 85 °C | |
| Rohs Code | Yes | |
| Package Code | TFBGA | |
| Package Shape | SQUARE | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Supply Voltage-Max | 1.26 V | |
| Risk Rank | 5.82 | |
| L1 Cache Instruction Memory | - | |
| Maximum Clock Frequency | 166 MHz | |
| Number of Logic Elements | 56520 LELogic Element | |
| L1 Cache Data Memory | - | |
| Data RAM Size | 64 kB |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Operating Temperature | 0 to 85 °C | |
| Series | SmartFusion®2 | |
| JESD-609 Code | e1 | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Color | Yellow | |
| Additional Feature | LG-MIN, WD-MIN | |
| HTS Code | 8542.39.00.01 | |
| Subcategory | Field Programmable Gate Arrays | |
| Technology | CMOS | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 250 | |
| Terminal Pitch | 0.5 mm | |
| Reach Compliance Code | compliant | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| JESD-30 Code | S-PBGA-B325 | |
| Number of Outputs | 200Outputs | |
| Qualification Status | Not Qualified | |
| Power Supplies | 1.2 V | |
| Temperature Grade | OTHER | |
| Speed | 166MHz | |
| RAM Size | 64KB | |
| Core Processor | ARM® Cortex®-M3 | |
| Peripherals | DDR, PCIe, SERDES | |
| Program Memory Size | 256 kB | |
| Connectivity | CANbus, Ethernet, I²C, SPI, UART/USART, USB | |
| Architecture | MCU, FPGA | |
| Number of Inputs | 200Inputs | |
| Seated Height-Max | 1.01 mm | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Speed Grade | STD | |
| Primary Attributes | FPGA - 60K Logic Modules | |
| Number of Logic Cells | 56520Logic Cells | |
| Number of Cores | 1 CoreCore | |
| Flash Size | 256KB | |
| Width | 11 mm | |
| Length | 11 mm | |
| Width (in) | 0.093 |
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