Локаль
Язык
- English
- русский
Валюта
- CNY-¥
- RUB-₽
Цена такой валюты может меняться в зависимости от курса только для справки
Корзина для покупок - Все продукты
- /
- Integrated Circuits (ICs)
- /
- Embedded - System On Chip (SoC)
- /
- M2S090-FCSG325I
Есть складские запасы
Min. : 1
Mult. : 1
Mult. : 1
Not available to buy on line? Want the lower wholesale price? Please
sendRFQ, we will
respond immediately
M2S090-FCSG325I Технические параметры
Microchip M2S090-FCSG325I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Embedded - System On Chip (SoC) | |
| Марка | Microchip | |
| Mounting Type | Through Hole | |
| Package / Case | 325-TFBGA, FCBGA | |
| Surface Mount | YES | |
| Number of Pins | 20Pins | |
| Supplier Device Package | 325-FCBGA (11x13.5) | |
| Housing Material | -- | |
| Number of Terminals | 325Terminals | |
| Contact Material - Mating | -- | |
| Contact Material - Post | Brass | |
| Board Material | FR4 Epoxy Glass | |
| Lead Free Status / RoHS Status | -- | |
| Contact Finish Mating | -- | |
| Number of I/Os | 180I/Os | |
| Package | Tray | |
| Base Product Number | M2S090 | |
| Mfr | Microchip Technology | |
| Product Status | Active | |
| Package Description | FBGA-325 | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Moisture Sensitivity Levels | 3 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Equivalence Code | BGA325,21X21,20 | |
| Supply Voltage-Nom | 1.2 V | |
| Reflow Temperature-Max (s) | 40 | |
| Supply Voltage-Min | 1.14 V | |
| Risk Rank | 5.74 | |
| Supply Voltage-Max | 1.26 V | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Part Life Cycle Code | Active | |
| Manufacturer | Microsemi Corporation | |
| Package Shape | RECTANGULAR | |
| Package Code | TFBGA | |
| Manufacturer Part Number | M2S090-FCSG325I | |
| Rohs Code | Yes | |
| L1 Cache Instruction Memory | - | |
| Maximum Clock Frequency | 166 MHz | |
| Number of Logic Elements | 86316 LELogic Element | |
| Mounting Styles | SMD/SMT | |
| L1 Cache Data Memory | - | |
| Data RAM Size | 64 kB | |
| Operating Temperature | -- | |
| Series | Correct-A-Chip® 352000 | |
| JESD-609 Code | e1 |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | -- | |
| Termination | Solder | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Additional Feature | LG-MIN, WD-MIN | |
| HTS Code | 8542.39.00.01 | |
| Subcategory | Field Programmable Gate Arrays | |
| Technology | CMOS | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 250 | |
| Terminal Pitch | 0.5 mm | |
| Reach Compliance Code | compliant | |
| Current Rating | 1A | |
| Pitch - Mating | 0.050 (1.27mm) | |
| JESD-30 Code | R-PBGA-B325 | |
| Number of Outputs | 180Outputs | |
| Qualification Status | Not Qualified | |
| Contact Finish - Post | Tin-Lead | |
| Power Supplies | 1.2 V | |
| Speed | 166MHz | |
| RAM Size | 64KB | |
| Core Processor | ARM® Cortex®-M3 | |
| Peripherals | DDR, PCIe, SERDES | |
| Program Memory Size | 512 kB | |
| Connectivity | CANbus, Ethernet, I²C, SPI, UART/USART, USB | |
| Architecture | MCU, FPGA | |
| Number of Inputs | 180Inputs | |
| Seated Height-Max | 1.16 mm | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Termination Post Length | 0.125 (3.18mm) | |
| Pitch - Post | 0.100 (2.54mm) | |
| Convert From (Adapter End) | PLCC | |
| Convert To (Adapter End) | DIP, 0.3 (7.62mm) Row Spacing | |
| Primary Attributes | FPGA - 90K Logic Modules | |
| Number of Logic Cells | 86316Logic Cells | |
| Number of Cores | 1 CoreCore | |
| Flash Size | 512KB | |
| Features | -- | |
| Width | 11 mm | |
| Length | 13.5 mm | |
| Contact Finish Thickness - Mating | -- | |
| Contact Finish Thickness - Post | -- | |
| Material Flammability Rating | -- |
Индекс :
0123456789ABCDEFGHIJKLMNOPQRSTUVWXYZ