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M2S090T-FGG676I Технические параметры
Microchip M2S090T-FGG676I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Embedded - System On Chip (SoC) | |
| Марка | Microchip | |
| Mounting Type | Surface Mount, Right Angle | |
| Package / Case | 676-BGA | |
| Surface Mount | YES | |
| Supplier Device Package | 676-FBGA (27x27) | |
| Housing Material | Thermoplastic, Glass Filled | |
| Number of Terminals | 676Terminals | |
| Actuator Material | -- | |
| Contact Materials | Phosphor Bronze | |
| ActuatorColor | -- | |
| Lead Free Status / RoHS Status | -- | |
| Voltage, Rating | 50V | |
| Number of I/Os | 425I/Os | |
| Package | Tray | |
| Base Product Number | M2S090 | |
| Mfr | Microchip Technology | |
| Product Status | Active | |
| L1 Cache Instruction Memory | - | |
| Maximum Clock Frequency | 166 MHz | |
| Number of Logic Elements | 86316 LELogic Element | |
| Mounting Styles | SMD/SMT | |
| L1 Cache Data Memory | - | |
| Data RAM Size | 64 kB | |
| Package Description | FBGA-676 | |
| Package Style | GRID ARRAY | |
| Moisture Sensitivity Levels | 3 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Supply Voltage-Nom | 1.2 V | |
| Reflow Temperature-Max (s) | 40 | |
| Supply Voltage-Min | 1.14 V | |
| Rohs Code | Yes | |
| Manufacturer Part Number | M2S090T-FGG676I | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Manufacturer | Microsemi Corporation | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Supply Voltage-Max | 1.26 V | |
| Risk Rank | 5.78 | |
| Packaging | Tape & Reel (TR) | |
| Operating Temperature | -20°C ~ 85°C | |
| Series | -- | |
| JESD-609 Code | e1 | |
| Part Status | Active |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Moisture Sensitivity Level (MSL) | -- | |
| Termination | Solder | |
| Number of Positions | 26Positions | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| HTS Code | 8542.39.00.01 | |
| Subcategory | Field Programmable Gate Arrays | |
| Pitch | 0.039 (1.00mm) | |
| Technology | CMOS | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 250 | |
| Terminal Pitch | 1 mm | |
| Reach Compliance Code | compliant | |
| Current Rating | 0.5A | |
| Contact Finish | Tin | |
| JESD-30 Code | S-PBGA-B676 | |
| Number of Outputs | 425Outputs | |
| Qualification Status | Not Qualified | |
| Housing Color | Black | |
| Power Supplies | 1.2 V | |
| Speed | 166MHz | |
| RAM Size | 64KB | |
| Core Processor | ARM® Cortex®-M3 | |
| Peripherals | DDR, PCIe, SERDES | |
| Program Memory Size | 512 kB | |
| Connectivity | CANbus, Ethernet, I²C, SPI, UART/USART, USB | |
| Architecture | MCU, FPGA | |
| Mating Cycles | -- | |
| Number of Inputs | 425Inputs | |
| Seated Height-Max | 2.44 mm | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Flat Flex Type | FPC | |
| Connector/Contact Type | Contacts, Bottom | |
| Cable End Type | Straight | |
| Locking Feature | -- | |
| Primary Attributes | FPGA - 90K Logic Modules | |
| Number of Logic Cells | 86316Logic Cells | |
| Number of Cores | 1 CoreCore | |
| Flash Size | 512KB | |
| Features | Solder Retention | |
| Width | 27 mm | |
| Length | 27 mm | |
| Contact Finish Thickness | 120.0µin (3.05µm) | |
| Height Above Board | 0.126 (3.20mm) | |
| FFC, FCB Thickness | 0.30mm | |
| Material Flammability Rating | UL94 V-0 |
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