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- M2S150TS-1FCG1152M
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M2S150TS-1FCG1152M Технические параметры
Microchip M2S150TS-1FCG1152M technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Embedded - System On Chip (SoC) | |
| Марка | Microchip | |
| Package / Case | 1152-BBGA, FCBGA | |
| Surface Mount | YES | |
| Supplier Device Package | 1152-FCBGA (35x35) | |
| Number of Terminals | 1152Terminals | |
| Factory Pack QuantityFactory Pack Quantity | 1 | |
| Manufacturer | Glenair | |
| Brand | Glenair | |
| Number of I/Os | 574I/Os | |
| Package | Tray | |
| Base Product Number | M2S150 | |
| Mfr | Microchip Technology | |
| Product Status | Active | |
| Package Description | FBGA-1152 | |
| Package Style | GRID ARRAY | |
| Moisture Sensitivity Levels | 4 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Operating Temperature-Min | -55 °C | |
| Supply Voltage-Nom | 1.2 V | |
| Supply Voltage-Min | 1.14 V | |
| Operating Temperature-Max | 125 °C | |
| Rohs Code | Yes | |
| Manufacturer Part Number | M2S150TS-1FCG1152M | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Supply Voltage-Max | 1.26 V | |
| Risk Rank | 5.8 | |
| Operating Temperature | -55°C ~ 125°C (TJ) | |
| Series | SmartFusion®2 |
| Свойство продукта | Значение свойства | |
|---|---|---|
| JESD-609 Code | e1 | |
| ECCN Code | 3A001.A.2.C | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| HTS Code | 8542.39.00.01 | |
| Subcategory | D-Sub Connectors | |
| Technology | CMOS | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 250 | |
| Terminal Pitch | 1 mm | |
| Reach Compliance Code | compliant | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| JESD-30 Code | S-PBGA-B1152 | |
| Number of Outputs | 574Outputs | |
| Qualification Status | Not Qualified | |
| Power Supplies | 1.2 V | |
| Temperature Grade | MILITARY | |
| Speed | 166MHz | |
| RAM Size | 64KB | |
| Core Processor | ARM® Cortex®-M3 | |
| Peripherals | DDR, PCIe, SERDES | |
| Connectivity | CANbus, Ethernet, I²C, SPI, UART/USART, USB | |
| Architecture | MCU, FPGA | |
| Number of Inputs | 574Inputs | |
| Seated Height-Max | 2.9 mm | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Product Type | Mixed Contact D-Sub Connectors | |
| Primary Attributes | FPGA - 150K Logic Modules | |
| Number of Logic Cells | 146124Logic Cells | |
| Flash Size | 512KB | |
| Product Category | D-Sub Mixed Contact Connectors | |
| Width | 35 mm | |
| Length | 35 mm |
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