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MAX24210EXG Технические параметры
Microchip MAX24210EXG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Clock/Timing - Application Specific | |
| Марка | Microchip | |
| Surface Mount | YES | |
| Number of Terminals | 81Terminals | |
| Package Description | LBGA, | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Package Body Material | PLASTIC/EPOXY | |
| Operating Temperature-Min | -40 °C | |
| Supply Voltage-Nom | 1.8 V | |
| Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Operating Temperature-Max | 85 °C | |
| Rohs Code | Yes | |
| Manufacturer Part Number | MAX24210EXG+ | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Manufacturer | Microsemi Corporation | |
| Part Life Cycle Code | Active |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Ihs Manufacturer | MICROSEMI CORP | |
| Risk Rank | 5.83 | |
| Part Package Code | BGA | |
| HTS Code | 8542.39.00.01 | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Number of Functions | 1Function | |
| Terminal Pitch | 1 mm | |
| Reach Compliance Code | compliant | |
| Pin Count | 81 | |
| JESD-30 Code | S-PBGA-B81 | |
| Temperature Grade | INDUSTRIAL | |
| Seated Height-Max | 1.47 mm | |
| Telecom IC Type | ATM/SONET/SDH SUPPORT CIRCUIT | |
| Width | 10 mm | |
| Length | 10 mm |
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