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MXPLAD30KP350CA Технические параметры

Microchip  MXPLAD30KP350CA technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Circuit Protection Kits - TVS Diodes
Марка Microchip
Surface Mount YES
Diode Element Material SILICON
Number of Terminals 1Terminal
Package Retail Package
Mfr Glenair
Product Status Active
Supplier Package PLAD
Peak Pulse Power Dissipation 250 W
Direction Type Bi-Directional
Mounting Surface Mount
Package Description S-PSSO-G1
Package Style SMALL OUTLINE
Moisture Sensitivity Levels 1
Package Body Material PLASTIC/EPOXY
Reflow Temperature-Max (s) NOT SPECIFIED
Rohs Code No
Manufacturer Part Number MXPLAD30KP350CA
Power Dissipation (Max) 2.5 W
Package Shape SQUARE
Manufacturer Microsemi Corporation
Number of Elements 1 Element
Part Life Cycle Code Active
Ihs Manufacturer MICROSEMI CORP
Risk Rank 5.45
Свойство продукта Значение свойства
Usage Level Military grade
Series *
Operating Temperature -55 to 150 °C
JESD-609 Code e0
Pbfree Code No
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8541.10.00.50
Technology AVALANCHE
Terminal Position SINGLE
Terminal Form GULL WING
Peak Reflow Temperature (Cel) NOT SPECIFIED
Reach Compliance Code not_compliant
Pin Count 2
JESD-30 Code S-PSSO-G1
Qualification Status Not Qualified
Polarity BIDIRECTIONAL
Configuration Single
Diode Type TRANS VOLTAGE SUPPRESSOR DIODE
Test Current 5 mA
Rep Pk Reverse Voltage-Max 350 V
Screening Level Military
Non-rep Peak Rev Power Dis-Max 30000 W
ESD Protection Yes
Breakdown Voltage-Min 389 V
Breakdown Voltage-Max 431 V
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