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- A2F200M3F-1CS288I
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A2F200M3F-1CS288I Технические параметры
Microchip Technology A2F200M3F-1CS288I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Embedded - System On Chip (SoC) | |
| Марка | ||
| Package / Case | 288-TFBGA, CSPBGA | |
| Surface Mount | YES | |
| Supplier Device Package | 288-CSP (11x11) | |
| Number of Terminals | 288Terminals | |
| RoHS | N | |
| Core | ARM Cortex M3 | |
| Maximum Clock Frequency | 100 MHz | |
| L1 Cache Instruction Memory | - | |
| L1 Cache Data Memory | - | |
| Data RAM Size | 64 kB | |
| Number of Logic Elements | 2000 LELogic Element | |
| Moisture Sensitive | Yes | |
| Number of Logic Array Blocks - LABs | -Logic Array Blocks - LAB | |
| Factory Pack QuantityFactory Pack Quantity | 176 | |
| Tradename | SmartFusion | |
| Number of I/Os | MCU - 31, FPGA - 78I/O | |
| Package | Tray | |
| Base Product Number | A2F200 | |
| Mfr | Microchip Technology | |
| Product Status | Active | |
| Package Description | TFBGA, BGA288,21X21,20 | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Equivalence Code | BGA288,21X21,20 | |
| Operating Temperature-Min | -40 °C | |
| Supply Voltage-Nom | 1.5 V | |
| Reflow Temperature-Max (s) | 20 | |
| Supply Voltage-Min | 1.425 V | |
| Operating Temperature-Max | 100 °C | |
| Rohs Code | No | |
| Manufacturer Part Number | A2F200M3F-1CS288I | |
| Clock Frequency-Max | 100 MHz | |
| Package Code | TFBGA | |
| Package Shape | SQUARE | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROSEMI CORP |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Supply Voltage-Max | 1.575 V | |
| Risk Rank | 1.56 | |
| Packaging | Tray | |
| Series | A2F200 | |
| Operating Temperature | -40°C ~ 100°C (TJ) | |
| JESD-609 Code | e0 | |
| Terminal Finish | TIN LEAD SILVER | |
| HTS Code | 8542.39.00.01 | |
| Technology | CMOS | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 235 | |
| Terminal Pitch | 0.5 mm | |
| Reach Compliance Code | compliant | |
| JESD-30 Code | S-PBGA-B288 | |
| Number of Outputs | 78Outputs | |
| Qualification Status | Not Qualified | |
| Power Supplies | 1.5,1.8,2.5,3.3 V | |
| Temperature Grade | INDUSTRIAL | |
| Speed | 100MHz | |
| RAM Size | 64KB | |
| Core Processor | ARM® Cortex®-M3 | |
| Peripherals | DMA, POR, WDT | |
| Program Memory Size | 256 kB | |
| Connectivity | EBI/EMI, Ethernet, I²C, SPI, UART/USART | |
| Architecture | MCU, FPGA | |
| Number of Inputs | 78Inputs | |
| Organization | 4608 CLBS, 200000 GATES | |
| Seated Height-Max | 1.05 mm | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Primary Attributes | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | |
| Number of CLBs | 4608CLBs | |
| Number of Logic Cells | 4608Logic Cells | |
| Number of Cores | 1 CoreCore | |
| Number of Equivalent Gates | 200000Equivalent Gates | |
| Flash Size | 256KB | |
| Width | 11 mm | |
| Length | 11 mm |
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