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- A2F200M3F-1FGG484I
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A2F200M3F-1FGG484I Технические параметры
Microchip Technology A2F200M3F-1FGG484I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Embedded - System On Chip (SoC) | |
| Марка | ||
| Package / Case | FPBGA-484 | |
| Surface Mount | YES | |
| Supplier Device Package | 484-FPBGA (23x23) | |
| Number of Terminals | 484Terminals | |
| RoHS | Details | |
| Mounting Styles | SMD/SMT | |
| Core | ARM Cortex M3 | |
| Maximum Clock Frequency | 100 MHz | |
| L1 Cache Instruction Memory | - | |
| L1 Cache Data Memory | - | |
| Data RAM Size | 64 kB | |
| Number of Logic Elements | 2000 LELogic Element | |
| Number of I/Os | 161 I/OI/O | |
| Minimum Operating Temperature | - 40 C | |
| Maximum Operating Temperature | + 100 C | |
| Moisture Sensitive | Yes | |
| Number of Logic Array Blocks - LABs | -Logic Array Blocks - LAB | |
| Factory Pack QuantityFactory Pack Quantity | 60 | |
| Tradename | SmartFusion | |
| Package | Tray | |
| Base Product Number | A2F200 | |
| Mfr | Microchip Technology | |
| Product Status | Active | |
| Package Description | BGA, BGA484,26X26,40 | |
| Package Style | GRID ARRAY | |
| Moisture Sensitivity Levels | 3 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Equivalence Code | BGA484,26X26,40 | |
| Operating Temperature-Min | -40 °C | |
| Supply Voltage-Nom | 1.5 V | |
| Reflow Temperature-Max (s) | 30 | |
| Supply Voltage-Min | 1.425 V | |
| Operating Temperature-Max | 100 °C | |
| Rohs Code | Yes | |
| Manufacturer Part Number | A2F200M3F-1FGG484I | |
| Clock Frequency-Max | 100 MHz | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Part Life Cycle Code | Active |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Ihs Manufacturer | MICROSEMI CORP | |
| Supply Voltage-Max | 1.575 V | |
| Risk Rank | 5.24 | |
| Packaging | Tray | |
| Series | A2F200 | |
| Operating Temperature | -40°C ~ 100°C (TJ) | |
| JESD-609 Code | e1 | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| HTS Code | 8542.39.00.01 | |
| Technology | CMOS | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 250 | |
| Terminal Pitch | 1 mm | |
| Reach Compliance Code | compliant | |
| JESD-30 Code | S-PBGA-B484 | |
| Number of Outputs | 94Outputs | |
| Qualification Status | Not Qualified | |
| Power Supplies | 1.5,1.8,2.5,3.3 V | |
| Temperature Grade | INDUSTRIAL | |
| Operating Supply Current | 1 mA | |
| Speed | 100MHz | |
| RAM Size | 64KB | |
| Core Processor | ARM® Cortex®-M3 | |
| Peripherals | DMA, POR, WDT | |
| Program Memory Size | 256 kB | |
| Connectivity | EBI/EMI, Ethernet, I²C, SPI, UART/USART | |
| Architecture | MCU, FPGA | |
| Number of Inputs | 94Inputs | |
| Organization | 4608 CLBS, 200000 GATES | |
| Seated Height-Max | 2.44 mm | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Number of Gates | 200000Gates | |
| Primary Attributes | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | |
| Number of CLBs | 4608CLBs | |
| Number of Logic Cells | 4608Logic Cells | |
| Number of Cores | 1 CoreCore | |
| Number of Equivalent Gates | 200000Equivalent Gates | |
| Flash Size | 256KB | |
| Width | 23 mm | |
| Length | 23 mm |
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