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Microchip Technology A3P600-FGG256I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
Свойство продукта | Значение свойства | |
---|---|---|
Классификация | Embedded - FPGAs (Field Programmable Gate Array) | |
Марка | ||
Lifecycle Status | Production (Last Updated: 1 month ago) | |
Package / Case | FBGA-256 | |
Mount | Surface Mount | |
Mounting Type | Surface Mount | |
Surface Mount | YES | |
Number of Pins | 256Pins | |
Supplier Device Package | 256-FPBGA (17x17) | |
Number of Terminals | 256Terminals | |
Shipping Restrictions | This product may require additional documentation to export from the United States. | |
RoHS | Details | |
Number of Logic Elements | 6500 LELogic Element | |
Number of I/Os | 177 I/OI/O | |
Supply Voltage-Min | 1.425 V | |
Minimum Operating Temperature | - 40 C | |
Maximum Operating Temperature | + 85 C | |
Mounting Styles | SMD/SMT | |
Maximum Operating Frequency | 231 MHz | |
Moisture Sensitive | Yes | |
Number of Logic Array Blocks - LABs | -Logic Array Blocks - LAB | |
Factory Pack QuantityFactory Pack Quantity | 90 | |
Total Memory | 110592 bit | |
Tradename | ProASIC3 | |
Typical Operating Supply Voltage | 1.5000 V | |
Supply Voltage-Max | 1.575 V | |
Package | Tray | |
Base Product Number | A3P600 | |
Mfr | Microchip Technology | |
Product Status | Active | |
Package Description | BGA, | |
Package Style | GRID ARRAY | |
Moisture Sensitivity Levels | 3 | |
Package Body Material | PLASTIC/EPOXY | |
Operating Temperature-Min | -40 °C | |
Supply Voltage-Nom | 1.5 V | |
Reflow Temperature-Max (s) | 40 | |
Operating Temperature-Max | 100 °C | |
Rohs Code | Yes | |
Manufacturer Part Number | A3P600-FGG256I | |
Clock Frequency-Max | 350 MHz | |
Package Code | BGA | |
Package Shape | SQUARE | |
Part Life Cycle Code | Active |
Свойство продукта | Значение свойства | |
---|---|---|
Ihs Manufacturer | MICROSEMI CORP | |
Risk Rank | 1.31 | |
Series | A3P600 | |
Packaging | Tray | |
Operating Temperature | -40 to 85 °C | |
JESD-609 Code | e1 | |
ECCN Code | 3A001.A.7.A | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Max Operating Temperature | 85 °C | |
Min Operating Temperature | -40 °C | |
HTS Code | 8542.39.00.01 | |
Technology | CMOS | |
Voltage - Supply | 1.425V ~ 1.575V | |
Terminal Position | BOTTOM | |
Terminal Form | BALL | |
Peak Reflow Temperature (Cel) | 260 | |
Terminal Pitch | 1 mm | |
Reach Compliance Code | compliant | |
Frequency | 231 MHz | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
Operating Supply Voltage | 1.5 V | |
Temperature Grade | INDUSTRIAL | |
Max Supply Voltage | 1.575 V | |
Min Supply Voltage | 1.425 V | |
Memory Size | 13.5 kB | |
Operating Supply Current | 45 mA | |
RAM Size | 13.5 kB | |
Organization | 13824 CLBS, 600000 GATES | |
Seated Height-Max | 1.8 mm | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Number of Logic Elements/Cells | 6500Logic Elements/Cells | |
Total RAM Bits | 110592 | |
Number of Gates | 600000Gates | |
Max Frequency | 231 MHz | |
Speed Grade | STD | |
Number of Registers | 13824Registers | |
Number of CLBs | 13824CLBs | |
Number of Equivalent Gates | 600000Equivalent Gates | |
Height | 1.2 mm | |
Length | 17 mm | |
Width | 17 mm | |
Radiation Hardening | No | |
Lead Free | Lead Free |