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- A42MX36-1BGG272
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A42MX36-1BGG272 Технические параметры
Microchip Technology A42MX36-1BGG272 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Embedded - FPGAs (Field Programmable Gate Array) | |
| Марка | ||
| Lifecycle Status | Production (Last Updated: 2 months ago) | |
| Package / Case | BGA-272 | |
| Mounting Type | Surface Mount | |
| Mount | Surface Mount | |
| Surface Mount | YES | |
| Number of Pins | 272Pins | |
| Supplier Device Package | 272-PBGA (27x27) | |
| Number of Terminals | 272Terminals | |
| Maximum Operating Frequency | 151 MHz | |
| Moisture Sensitive | Yes | |
| Factory Pack QuantityFactory Pack Quantity | 40 | |
| Tradename | Actel | |
| RoHS | Details | |
| Number of I/Os | 202 I/OI/O | |
| Supply Voltage-Min | 3 V | |
| Minimum Operating Temperature | 0 C | |
| Maximum Operating Temperature | + 70 C | |
| Mounting Styles | SMD/SMT | |
| Package | Tray | |
| Base Product Number | A42MX36 | |
| Mfr | Microchip Technology | |
| Product Status | Obsolete | |
| Supply Voltage-Max | 5.25 V | |
| Package Description | BGA, | |
| Package Style | GRID ARRAY | |
| Moisture Sensitivity Levels | 3 | |
| Package Body Material | PLASTIC/EPOXY | |
| Supply Voltage-Nom | 3.3 V | |
| Reflow Temperature-Max (s) | 40 | |
| Operating Temperature-Max | 70 °C | |
| Rohs Code | Yes | |
| Manufacturer Part Number | A42MX36-1BGG272 | |
| Clock Frequency-Max | 83 MHz | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Risk Rank | 5.25 |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Series | A42MX36 | |
| Packaging | Tray | |
| Operating Temperature | 0°C ~ 70°C (TA) | |
| JESD-609 Code | e1 | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Max Operating Temperature | 70 °C | |
| Min Operating Temperature | 0 °C | |
| Additional Feature | ALSO OPERATES AT 5V SUPPLY | |
| HTS Code | 8542.39.00.01 | |
| Technology | CMOS | |
| Voltage - Supply | 3V ~ 3.6V, 4.75V ~ 5.25V | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 250 | |
| Terminal Pitch | 1.27 mm | |
| Reach Compliance Code | compliant | |
| JESD-30 Code | S-PBGA-B272 | |
| Qualification Status | Not Qualified | |
| Operating Supply Voltage | 3.3 V, 5 V | |
| Temperature Grade | COMMERCIAL | |
| Max Supply Voltage | 5.25 V | |
| Min Supply Voltage | 3 V | |
| RAM Size | 320 B | |
| Organization | 2438 CLBS, 54000 GATES | |
| Seated Height-Max | 2.5 mm | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Number of Logic Elements/Cells | 1184Logic Elements/Cells | |
| Total RAM Bits | 2560 | |
| Number of Gates | 54000Gates | |
| Max Frequency | 151 MHz | |
| Number of Logic Blocks (LABs) | 1184Logic Blocks (LABs)s | |
| Speed Grade | 1 | |
| Number of Registers | 1822Registers | |
| Combinatorial Delay of a CLB-Max | 2.3 ns | |
| Number of CLBs | 2438CLBs | |
| Number of Equivalent Gates | 54000Equivalent Gates | |
| Width | 27 mm | |
| Height | 1.73 mm | |
| Length | 27 mm | |
| Radiation Hardening | No |
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