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- Integrated Circuits (ICs)
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- Embedded - FPGAs (Field Programmable Gate Array)
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- AFS250-2FG256
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AFS250-2FG256 Технические параметры
Microchip Technology AFS250-2FG256 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Embedded - FPGAs (Field Programmable Gate Array) | |
| Марка | ||
| Lifecycle Status | Production (Last Updated: 2 months ago) | |
| Package / Case | FBGA | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Surface Mount | YES | |
| Number of Pins | 256Pins | |
| Supplier Device Package | 256-FPBGA (17x17) | |
| Weight | 400.011771 mg | |
| Number of Terminals | 256Terminals | |
| Shipping Restrictions | This product may require additional documentation to export from the United States. | |
| RoHS | N | |
| Number of Logic Elements | 3000 LELogic Element | |
| Number of I/Os | 114 I/OI/O | |
| Supply Voltage-Min | 1.425 V | |
| Minimum Operating Temperature | 0 C | |
| Maximum Operating Temperature | + 70 C | |
| Mounting Styles | SMD/SMT | |
| Maximum Operating Frequency | 1470.59 MHz | |
| Moisture Sensitive | Yes | |
| Factory Pack QuantityFactory Pack Quantity | 90 | |
| Tradename | Fusion | |
| Unit Weight | 0.014110 oz | |
| Supply Voltage-Max | 1.575 V | |
| Package | Tray | |
| Base Product Number | AFS250 | |
| Mfr | Microchip Technology | |
| Product Status | Active | |
| Package Description | LBGA, | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Moisture Sensitivity Levels | 3 | |
| Package Body Material | PLASTIC/EPOXY | |
| Supply Voltage-Nom | 1.5 V | |
| Reflow Temperature-Max (s) | 30 | |
| Operating Temperature-Max | 85 °C | |
| Rohs Code | No | |
| Manufacturer Part Number | AFS250-2FG256 | |
| Package Code | LBGA |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Package Shape | SQUARE | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Risk Rank | 5.3 | |
| Series | AFS250 | |
| Packaging | Tray | |
| Operating Temperature | 0°C ~ 85°C (TJ) | |
| Terminal Finish | TIN LEAD/TIN LEAD SILVER | |
| Max Operating Temperature | 70 °C | |
| Min Operating Temperature | 0 °C | |
| HTS Code | 8542.39.00.01 | |
| Technology | CMOS | |
| Voltage - Supply | 1.425V ~ 1.575V | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 225 | |
| Terminal Pitch | 1 mm | |
| Reach Compliance Code | unknown | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| Operating Supply Voltage | 1.5 V | |
| Temperature Grade | OTHER | |
| Max Supply Voltage | 1.575 V | |
| Min Supply Voltage | 1.425 V | |
| RAM Size | 4.5 kB | |
| Organization | 6144 CLBS, 250000 GATES | |
| Seated Height-Max | 1.68 mm | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Total RAM Bits | 36864 | |
| Number of Gates | 250000Gates | |
| Max Frequency | 1.47059 GHz | |
| Speed Grade | 2 | |
| Number of Registers | 6144Registers | |
| Number of CLBs | 6144CLBs | |
| Number of Equivalent Gates | 250000Equivalent Gates | |
| Height | 1.2 mm | |
| Length | 17 mm | |
| Width | 17 mm | |
| Radiation Hardening | No |
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