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- AGL600V2-FGG256
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AGL600V2-FGG256 Технические параметры
Microchip Technology AGL600V2-FGG256 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Embedded - FPGAs (Field Programmable Gate Array) | |
| Марка | ||
| Package / Case | FBGA-256 | |
| Mounting Type | Surface Mount | |
| Surface Mount | YES | |
| Supplier Device Package | 256-FPBGA (17x17) | |
| Number of Terminals | 256Terminals | |
| Shipping Restrictions | This product may require additional documentation to export from the United States. | |
| RoHS | Details | |
| Number of Logic Elements | 6500 LELogic Element | |
| Number of I/Os | 177 I/OI/O | |
| Supply Voltage-Min | 1.14 V | |
| Minimum Operating Temperature | 0 C | |
| Maximum Operating Temperature | + 70 C | |
| Mounting Styles | SMD/SMT | |
| Maximum Operating Frequency | 526.32 MHz, 892.86 MHz | |
| Moisture Sensitive | Yes | |
| Number of Logic Array Blocks - LABs | -Logic Array Blocks - LAB | |
| Factory Pack QuantityFactory Pack Quantity | 90 | |
| Total Memory | 110592 bit | |
| Tradename | IGLOOe | |
| Typical Operating Supply Voltage | 1.2, 1.5 V | |
| Minimum Operating Supply Voltage | 1.14 V | |
| Maximum Operating Supply Voltage | 1.575 V | |
| Package | Tray | |
| Base Product Number | AGL600 | |
| Mfr | Microchip Technology | |
| Product Status | Active | |
| Supply Voltage-Max | 1.575 V | |
| Package Description | BGA, | |
| Package Style | GRID ARRAY | |
| Moisture Sensitivity Levels | 3 | |
| Package Body Material | PLASTIC/EPOXY | |
| Supply Voltage-Nom | 1.2 V | |
| Reflow Temperature-Max (s) | 40 | |
| Operating Temperature-Max | 85 °C | |
| Rohs Code | Yes |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Manufacturer Part Number | AGL600V2-FGG256 | |
| Clock Frequency-Max | 108 MHz | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Risk Rank | 1.46 | |
| Series | AGL600V2 | |
| Packaging | Tray | |
| Operating Temperature | 0 to 70 °C | |
| JESD-609 Code | e1 | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| HTS Code | 8542.39.00.01 | |
| Technology | CMOS | |
| Voltage - Supply | 1.14V ~ 1.575V | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Terminal Pitch | 1 mm | |
| Reach Compliance Code | compliant | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| Operating Supply Voltage | 1.2 V to 1.5 V | |
| Temperature Grade | OTHER | |
| Organization | 13824 CLBS, 600000 GATES | |
| Seated Height-Max | 1.8 mm | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Number of Logic Elements/Cells | 13824Logic Elements/Cells | |
| Total RAM Bits | 110592 | |
| Number of Gates | 600000Gates | |
| Speed Grade | STD | |
| Number of CLBs | 13824CLBs | |
| Number of Equivalent Gates | 600000Equivalent Gates | |
| Height | 1.2 mm | |
| Length | 17 mm | |
| Width | 17 mm |
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