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APA300-BG456I Технические параметры

Microchip Technology  APA300-BG456I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - FPGAs (Field Programmable Gate Array)
Марка
Package / Case BGA-456
Mounting Type Surface Mount
Surface Mount YES
Supplier Device Package 456-PBGA (35x35)
Number of Terminals 456Terminals
Shipping Restrictions This product may require additional documentation to export from the United States.
RoHS N
Number of I/Os 290 I/OI/O
Supply Voltage-Min 2.3 V
Minimum Operating Temperature - 40 C
Maximum Operating Temperature + 85 C
Mounting Styles SMD/SMT
Maximum Operating Frequency 180 MHz
Moisture Sensitive Yes
Factory Pack QuantityFactory Pack Quantity 24
Tradename Actel
Family Name PROASICPLUS
Operating Temperature (Max.) 85C
Operating Temperature Classification INDUSTRIALC
Package Type BGA
Device System Gates 300000
Operating Temp Range -40C to 85C
# I/Os (Max) 290
Number of Usable Gates 300000Usable Gates
Process Technology 0.22UM
Operating Supply Voltage (Max) 2.7(V)
Operating Supply Voltage (Typ) 2.5(V)
Rad Hardened No
Operating Supply Voltage (Min) 2.3(V)
Operating Temperature (Min.) -40C
Programmable Yes
# Registers 8192
Mounting Surface Mount
Supply Voltage-Max 2.7 V
Package Tray
Base Product Number APA300
Mfr Microchip Technology
Product Status Active
Package Description BGA, BGA456,26X26,50
Package Style GRID ARRAY
Moisture Sensitivity Levels 3
Package Body Material PLASTIC/EPOXY
Package Equivalence Code BGA456,26X26,50
Operating Temperature-Min -40 °C
Свойство продукта Значение свойства
Supply Voltage-Nom 2.5 V
Reflow Temperature-Max (s) 30
Operating Temperature-Max 85 °C
Rohs Code No
Manufacturer Part Number APA300-BG456I
Clock Frequency-Max 180 MHz
Package Code BGA
Package Shape SQUARE
Part Life Cycle Code Active
Samacsys Description FPGA ProASICPLUS Family 300K Gates 180MHz 0.22um Technology 2.5V 456-Pin BGA Tray
Ihs Manufacturer MICROSEMI CORP
Risk Rank 5.24
Series APA300
Packaging Tray
Operating Temperature -40°C ~ 85°C (TA)
JESD-609 Code e0
ECCN Code 3A001.A.7.A
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Technology CMOS
Voltage - Supply 2.3V ~ 2.7V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Terminal Pitch 1.27 mm
Reach Compliance Code unknown
Frequency 180(MHz)
Pin Count 456
JESD-30 Code S-PBGA-B456
Number of Outputs 290Outputs
Qualification Status Not Qualified
Operating Supply Voltage 2.5 V
Power Supplies 2.5,2.5/3.3 V
Temperature Grade INDUSTRIAL
Number of Inputs 290Inputs
Organization 300000 GATES
Seated Height-Max 2.54 mm
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Total RAM Bits 73728
Number of Gates 300000Gates
Number of Logic Cells 8192Logic Cells
Number of Equivalent Gates 300000Equivalent Gates
Height 1.73 mm
Length 35 mm
Width 35 mm
Просмотр сходства
APA300-BG456I brand manufacturers: Microchip Technology, Anli stock, APA300-BG456I reference price.Microchip Technology. APA300-BG456I parameters, APA300-BG456I Datasheet PDF and pin diagram description download.You can use the APA300-BG456I Embedded - FPGAs (Field Programmable Gate Array), DSP Datesheet PDF, find APA300-BG456I pin diagram and circuit diagram and usage method of function,APA300-BG456I electronics tutorials.You can download from the Anli.