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- Integrated Circuits (ICs)
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- APA300-BG456M
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APA300-BG456M Технические параметры
Microchip Technology APA300-BG456M technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Embedded - FPGAs (Field Programmable Gate Array) | |
| Марка | ||
| Package / Case | BGA-456 | |
| Mounting Type | Surface Mount | |
| Surface Mount | YES | |
| Supplier Device Package | 456-PBGA (35x35) | |
| Number of Terminals | 456Terminals | |
| Shipping Restrictions | This product may require additional documentation to export from the United States. | |
| RoHS | N | |
| Number of I/Os | 290 I/OI/O | |
| Supply Voltage-Min | 2.3 V | |
| Minimum Operating Temperature | - 55 C | |
| Maximum Operating Temperature | + 125 C | |
| Mounting Styles | SMD/SMT | |
| Maximum Operating Frequency | 180 MHz | |
| Moisture Sensitive | Yes | |
| Factory Pack QuantityFactory Pack Quantity | 24 | |
| Tradename | Actel | |
| Supply Voltage-Max | 2.7 V | |
| Package | Tray | |
| Base Product Number | APA300 | |
| Mfr | Microchip Technology | |
| Product Status | Active | |
| Package Description | BGA, BGA456,26X26,50 | |
| Package Style | GRID ARRAY | |
| Moisture Sensitivity Levels | 3 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Equivalence Code | BGA456,26X26,50 | |
| Operating Temperature-Min | -55 °C | |
| Supply Voltage-Nom | 2.5 V | |
| Reflow Temperature-Max (s) | 30 | |
| Operating Temperature-Max | 125 °C | |
| Rohs Code | No | |
| Manufacturer Part Number | APA300-BG456M | |
| Clock Frequency-Max | 180 MHz | |
| Package Code | BGA |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Package Shape | SQUARE | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Risk Rank | 5.23 | |
| Series | APA300 | |
| Packaging | Tray | |
| Operating Temperature | -55°C ~ 125°C (TC) | |
| JESD-609 Code | e0 | |
| ECCN Code | 3A001.A.2.C | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| HTS Code | 8542.39.00.01 | |
| Technology | CMOS | |
| Voltage - Supply | 2.3V ~ 2.7V | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 225 | |
| Terminal Pitch | 1.27 mm | |
| Reach Compliance Code | unknown | |
| JESD-30 Code | S-PBGA-B456 | |
| Number of Outputs | 290Outputs | |
| Qualification Status | Not Qualified | |
| Operating Supply Voltage | 2.5 V | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Temperature Grade | MILITARY | |
| Number of Inputs | 290Inputs | |
| Organization | 300000 GATES | |
| Seated Height-Max | 2.54 mm | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Total RAM Bits | 73728 | |
| Number of Gates | 300000Gates | |
| Number of Logic Cells | 8192Logic Cells | |
| Number of Equivalent Gates | 300000Equivalent Gates | |
| Height | 1.73 mm | |
| Length | 35 mm | |
| Width | 35 mm |
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