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M2S060T-1FGG676 Технические параметры

Microchip Technology  M2S060T-1FGG676 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - System On Chip (SoC)
Марка
Package / Case BGA-676
Supplier Device Package 676-FBGA (27x27)
Shipping Restrictions This product may require additional documentation to export from the United States.
RoHS Details
Mounting Styles SMD/SMT
Core ARM Cortex M3
Maximum Clock Frequency 166 MHz
L1 Cache Instruction Memory -
L1 Cache Data Memory -
Data RAM Size 64 kB
Number of Logic Elements 56520 LELogic Element
Number of I/Os 387 I/OI/O
Minimum Operating Temperature 0 C
Maximum Operating Temperature + 85 C
Distributed RAM 1314 kbit
Number of Logic Array Blocks - LABs 4710 LABLogic Array Blocks - LAB
Factory Pack QuantityFactory Pack Quantity 40
Свойство продукта Значение свойства
Tradename SmartFusion2
Package Tray
Base Product Number M2S060
Mfr Microchip Technology
Product Status Active
Packaging Tray
Series SmartFusion2
Operating Temperature 0°C ~ 85°C (TJ)
Operating Supply Voltage 1.2 V
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Program Memory Size 256 kB
Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB
Architecture MCU, FPGA
Primary Attributes FPGA - 60K Logic Modules
Number of Cores 1 CoreCore
Flash Size 256KB
Просмотр сходства
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