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M2S090TS-FG676I Технические параметры

Microchip Technology  M2S090TS-FG676I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - System On Chip (SoC)
Марка
Package / Case BGA-676
Supplier Device Package 676-FBGA (27x27)
Shipping Restrictions This product may require additional documentation to export from the United States.
RoHS N
Mounting Styles SMD/SMT
Core ARM Cortex M3
Maximum Clock Frequency 166 MHz
L1 Cache Instruction Memory -
L1 Cache Data Memory -
Data RAM Size 64 kB
Number of Logic Elements 86316 LELogic Element
Moisture Sensitive Yes
Number of Logic Array Blocks - LABs 7193 LABLogic Array Blocks - LAB
Factory Pack QuantityFactory Pack Quantity 40
Number of I/Os 425I/Os
Свойство продукта Значение свойства
Package Tray
Base Product Number M2S090
Mfr Microchip Technology
Product Status Active
Packaging Tray
Series SmartFusion2
Operating Temperature -40°C ~ 100°C (TJ)
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Program Memory Size 512 kB
Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB
Architecture MCU, FPGA
Primary Attributes FPGA - 90K Logic Modules
Number of Cores 1 CoreCore
Flash Size 512KB
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