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- Integrated Circuits (ICs)
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- M7A3P1000-FGG144I
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M7A3P1000-FGG144I Технические параметры
Microchip Technology M7A3P1000-FGG144I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Embedded - FPGAs (Field Programmable Gate Array) | |
| Марка | ||
| Package / Case | FBGA | |
| Mounting Type | Surface Mount | |
| Mount | Surface Mount | |
| Surface Mount | YES | |
| Number of Pins | 144Pins | |
| Supplier Device Package | 144-FPBGA (13x13) | |
| Weight | 400.011771 mg | |
| Number of Terminals | 144Terminals | |
| Shipping Restrictions | This product may require additional documentation to export from the United States. | |
| RoHS | Details | |
| Number of I/Os | 97 I/OI/O | |
| Supply Voltage-Min | 1.425 V | |
| Minimum Operating Temperature | - 40 C | |
| Maximum Operating Temperature | + 85 C | |
| Mounting Styles | SMD/SMT | |
| Maximum Operating Frequency | 231 MHz | |
| Moisture Sensitive | Yes | |
| Factory Pack QuantityFactory Pack Quantity | 160 | |
| Tradename | ProASIC3 | |
| Unit Weight | 0.014110 oz | |
| Package | Tray | |
| Base Product Number | M7A3P1000 | |
| Mfr | Microchip Technology | |
| Product Status | Active | |
| Supply Voltage-Max | 1.575 V | |
| Package Description | LBGA, | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Moisture Sensitivity Levels | 3 | |
| Package Body Material | PLASTIC/EPOXY | |
| Operating Temperature-Min | -40 °C | |
| Supply Voltage-Nom | 1.5 V | |
| Reflow Temperature-Max (s) | 40 | |
| Operating Temperature-Max | 85 °C | |
| Rohs Code | Yes | |
| Manufacturer Part Number | M7A3P1000-FGG144I | |
| Clock Frequency-Max | 350 MHz | |
| Package Code | LBGA | |
| Package Shape | SQUARE |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Part Life Cycle Code | Not Recommended | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Risk Rank | 5.25 | |
| Series | M7A3P1000 | |
| Packaging | Tray | |
| Operating Temperature | -40°C ~ 100°C (TJ) | |
| JESD-609 Code | e1 | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Max Operating Temperature | 85 °C | |
| Min Operating Temperature | -40 °C | |
| HTS Code | 8542.39.00.01 | |
| Technology | CMOS | |
| Voltage - Supply | 1.425V ~ 1.575V | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Terminal Pitch | 1 mm | |
| Reach Compliance Code | compliant | |
| Frequency | 231 MHz | |
| JESD-30 Code | S-PBGA-B144 | |
| Qualification Status | Not Qualified | |
| Operating Supply Voltage | 1.5 V | |
| Temperature Grade | INDUSTRIAL | |
| Max Supply Voltage | 1.575 V | |
| Min Supply Voltage | 1.425 V | |
| RAM Size | 18 kB | |
| Organization | 24576 CLBS, 1000000 GATES | |
| Seated Height-Max | 1.55 mm | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Total RAM Bits | 147456 | |
| Number of Gates | 1000000Gates | |
| Max Frequency | 231 MHz | |
| Speed Grade | STD | |
| Number of Registers | 24576Registers | |
| Number of CLBs | 24576CLBs | |
| Number of Equivalent Gates | 1000000Equivalent Gates | |
| Height | 1.05 mm | |
| Length | 13 mm | |
| Width | 13 mm | |
| Radiation Hardening | No |
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