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PCX755BVZFU300LE Технические параметры

Microchip Technology  PCX755BVZFU300LE technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - Microprocessors
Марка
Package / Case 360-BBGA Exposed Pad
Supplier Device Package 360-PBGA (25x25)
Operating Temperature -40°C~110°C TJ
Packaging Tray
Published 2006
Part Status Obsolete
Свойство продукта Значение свойства
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number PCX755
Speed 300MHz
Core Processor PowerPC
Voltage - I/O 2.5V 3.3V
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RoHS Status Non-RoHS Compliant

PCX755BVZFU300LE Документы

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