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PIC18F25K50-E/SP Технические параметры

Microchip Technology  PIC18F25K50-E/SP technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - Microcontrollers
Марка
Factory Lead Time 6 Weeks
Mounting Type Through Hole
Package / Case 28-DIP (0.300, 7.62mm)
Surface Mount NO
Data Converters A/D 14x10b
Number of I/Os 25I/Os
ROM(word) 16384
Operating Temperature -40°C~125°C TA
Packaging Tube
Series PIC® XLP™ 18K
Published 2012
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 28Terminations
ECCN Code 3A001.A.3
Terminal Finish Matte Tin (Sn) - annealed
Additional Feature IT ALSO OPEARTES IN 16MHZ AT 2.3V MIN SUPPLY
HTS Code 8542.31.00.01
Terminal Position DUAL
Peak Reflow Temperature (Cel) NOT APPLICABLE
Supply Voltage 3V
Terminal Pitch 2.54mm
Frequency 48MHz
Time@Peak Reflow Temperature-Max (s) NOT APPLICABLE
Свойство продукта Значение свойства
Base Part Number PIC18F25K50
JESD-30 Code R-PDIP-T28
Supply Voltage-Max (Vsup) 5.5V
Supply Voltage-Min (Vsup) 2.7V
Interface I2C, SPI, UART, USART, USB
Oscillator Type Internal
RAM Size 2K x 8
Voltage - Supply (Vcc/Vdd) 2.3V~5.5V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Core Processor PIC
Peripherals Brown-out Detect/Reset, POR, PWM, WDT
Program Memory Type FLASH
Core Size 8-Bit
Program Memory Size 32KB 16K x 16
Connectivity I2C, SPI, UART/USART, USB
Bit Size 8
Has ADC YES
DMA Channels NO
PWM Channels YES
DAC Channels YES
EEPROM Size 256 x 8
On Chip Program ROM Width 16
Length 34.671mm
Height Seated (Max) 5.08mm
Width 7.62mm
RoHS Status ROHS3 Compliant

PIC18F25K50-E/SP Документы

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