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- MT29F512G08CUCABH3-12Z:A
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MT29F512G08CUCABH3-12Z:A Технические параметры
Micron MT29F512G08CUCABH3-12Z:A technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Memory | |
| Марка | ||
| Surface Mount | YES | |
| Number of Terminals | 100Terminals | |
| Package Description | 12 X 18 MM, 1.40 MM HEIGHT, LEAD FREE, LBGA-100 | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Number of Words Code | 64000000000Words Codes | |
| Package Body Material | PLASTIC/EPOXY | |
| Reflow Temperature-Max (s) | 30 | |
| Operating Temperature-Max | 70 °C | |
| Rohs Code | Yes | |
| Manufacturer Part Number | MT29F512G08CUCABH3-12Z:A | |
| Number of Words | 68719476736 wordsWord | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Package Code | LBGA | |
| Package Shape | RECTANGULAR | |
| Manufacturer | Micron Technology Inc | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MICRON TECHNOLOGY INC | |
| Risk Rank | 5.83 | |
| Part Package Code | BGA | |
| JESD-609 Code | e1 | |
| Pbfree Code | Yes | |
| ECCN Code | 3A991.B.1.A | |
| Type | MLC NAND TYPE |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| HTS Code | 8542.32.00.51 | |
| Technology | CMOS | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Number of Functions | 1Function | |
| Terminal Pitch | 1 mm | |
| Reach Compliance Code | compliant | |
| Pin Count | 100 | |
| JESD-30 Code | R-PBGA-B100 | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Temperature Grade | COMMERCIAL | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Operating Mode | SYNCHRONOUS | |
| Organization | 64GX8 | |
| Seated Height-Max | 1.4 mm | |
| Memory Width | 8 | |
| Memory Density | 549755813888 bit | |
| Parallel/Serial | PARALLEL | |
| Memory IC Type | FLASH | |
| Programming Voltage | 2.7 V | |
| Width | 12 mm | |
| Length | 18 mm |
Индекс :
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