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NAND16GAH0HZA5E Технические параметры

Micron  NAND16GAH0HZA5E technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory
Марка
Surface Mount YES
Number of Terminals 169Terminals
Package Description FBGA, BGA169,14X28,20
Package Style GRID ARRAY, FINE PITCH
Package Body Material PLASTIC/EPOXY
Package Equivalence Code BGA169,14X28,20
Operating Temperature-Min -25 °C
Operating Temperature-Max 85 °C
Rohs Code Yes
Manufacturer Part Number NAND16GAH0HZA5E
Package Code FBGA
Package Shape RECTANGULAR
Manufacturer Micron Technology Inc
Свойство продукта Значение свойства
Part Life Cycle Code Active
Ihs Manufacturer MICRON TECHNOLOGY INC
Risk Rank 5.69
Subcategory Other Memory ICs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 0.5 mm
Reach Compliance Code compliant
JESD-30 Code R-PBGA-B169
Qualification Status Not Qualified
Power Supplies 1.8/3.3,3.3 V
Temperature Grade OTHER
Supply Current-Max 0.15 mA
Memory Density 17179869184 bit
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