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MT16LSDT6464AG-133C2 Технические параметры

Micron Technology  MT16LSDT6464AG-133C2 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory Cards
Марка Micron Technology
ECCN (US) EAR99
Module DRAM Module
Module Density 512Mbyte
Number of Chip per Module 16Chip per Modules
Chip Density (bit) 256M
Data Bus Width (bit) 64
Max. Access Time (ns) 6|5.4
Maximum Clock Rate (MHz) 133
Chip Configuration 32Mx8
Minimum Operating Supply Voltage (V) 3
Typical Operating Supply Voltage (V) 3.3
Maximum Operating Supply Voltage (V) 3.6
Operating Current (mA) 1096
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 70
Supplier Temperature Grade Commercial
ECC Support No
Свойство продукта Значение свойства
Number of Ranks DualRank
CAS Latency 3
Standard Package Name DIM
Supplier Package DIMM
Mounting Socket
Package Height 28.73(Max)
Package Length 133.5(Max)
Package Width 3.18(Max)
PCB changed 168
Lead Shape No Lead
Packaging Tray
Part Status Unconfirmed
Pin Count 168
Organization 64Mx64
Refresh Cycles 8K
Self Refresh Yes
Module Type 168UDIMM
RoHS Status RoHS non-compliant

MT16LSDT6464AG-133C2 Документы

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