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MT18LSDT3272Y-133G2 Технические параметры

Micron Technology  MT18LSDT3272Y-133G2 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory Cards
Марка Micron Technology
ECCN (US) EAR99
Module DRAM Module
Module Density 256Mbyte
Number of Chip per Module 18Chip per Modules
Chip Density (bit) 128M
Data Bus Width (bit) 72
Max. Access Time (ns) 6|5.4
Maximum Clock Rate (MHz) 133
Chip Configuration 32Mx4
Minimum Operating Supply Voltage (V) 3
Typical Operating Supply Voltage (V) 3.3
Maximum Operating Supply Voltage (V) 3.6
Operating Current (mA) 2700
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 55
Supplier Temperature Grade Commercial
Module Sides Double
ECC Support Yes
Number of Ranks SingleRank
Свойство продукта Значение свойства
Number of Chip Banks 4Chip Banks
CAS Latency 3
PC Type PC-133
SPD EEPROM Support Yes
Standard Package Name DIM
Supplier Package RDIMM
Mounting Socket
Package Height 30.63(Max)
Package Length 133.5(Max)
Package Width 4(Max)
PCB changed 168
Lead Shape No Lead
Packaging Tray
Part Status Obsolete
Pin Count 168
Organization 32Mx72
PLL Yes
Refresh Cycles 4K
Self Refresh Yes
Module Type 168RDIMM
RoHS Status Yes with exemptions

MT18LSDT3272Y-133G2 Документы

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