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Micron Technology MT29GZ6A6BPIET-046AAT.112 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Memory | |
| Марка | Micron Technology | |
| Mounting Type | Free Hanging (In-Line) | |
| Package / Case | 149-VFBGA | |
| Mounting Feature | - | |
| Shell Material | Aluminum | |
| Supplier Device Package | 149-VFBGA (8x9.5) | |
| Insert Material | Thermoplastic | |
| Backshell Material, Plating | - | |
| Contact Finish Mating | Gold | |
| Contact Materials | Copper Alloy | |
| Product Status | Active | |
| Mfr | Amphenol Aerospace Operations | |
| Base Product Number | TVS06RF | |
| Primary Material | Metal | |
| Package | Bulk | |
| Voltage, Rating | - | |
| Memory Types | Non-Volatile, Volatile | |
| Factory Pack QuantityFactory Pack Quantity | 1260 | |
| Manufacturer | Micron Technology | |
| Brand | Micron | |
| Series | MIL-DTL-38999 Series III, Tri-Start™ TV | |
| Operating Temperature | -65°C ~ 200°C | |
| Packaging | Tray | |
| Termination | Crimp | |
| Connector Type | Plug, Male Pins | |
| Number of Positions | 6Positions |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Color | Silver | |
| Applications | Aviation, Marine, Military | |
| Fastening Type | Threaded | |
| Subcategory | Memory & Data Storage | |
| Current Rating (Amps) | - | |
| Technology | FLASH - NAND (SLC), DRAM - LPDDR4 | |
| Voltage - Supply | 1.06V ~ 1.17V, 1.7V ~ 1.95V | |
| Orientation | E | |
| Shielding | Shielded | |
| Ingress Protection | Environment Resistant | |
| Shell Finish | Electroless Nickel | |
| Shell Size - Insert | 17-6 | |
| Memory Size | 8Gbit (NAND), 8Gbit (LPDDR4) | |
| Shell Size, MIL | - | |
| Clock Frequency | 2.133 GHz | |
| Cable Opening | - | |
| Access Time | 25 ns | |
| Memory Format | FLASH, RAM | |
| Memory Interface | ONFI | |
| Write Cycle Time - Word, Page | 20ns, 30ns | |
| Product Type | Multichip Packages | |
| Features | Coupling Nut, Self Locking | |
| Product Category | Multichip Packages | |
| Memory Organization | 1G x 8 (NAND), 512M x 16 (LPDDR4) | |
| Contact Finish Thickness - Mating | 50.0µin (1.27µm) | |
| Material Flammability Rating | - |