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NAND01GR3B2CZA6F Технические параметры

Micron Technology   NAND01GR3B2CZA6F technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация USB Flash Drives
Марка
Surface Mount YES
Number of Terminals 63Terminals
EU RoHS Compliant
ECCN (US) 3A991.b.1.a
Automotive No
PPAP No
Cell Type NAND
Chip Density (bit) 1G
Block Organization Symmetrical
Address Bus Width (bit) 28
Number of Bits/Word (bit) 8Bits/Word (bit)s
Number of Words 128MWord
Programmability Yes
Timing Type Asynchronous
Max. Access Time (ns) 25000
Maximum Erase Time (S) 0.003/Block
Maximum Page Access Time (ns) 45(Min)
Maximum Programming Time (ms) 0.7/Page
Interface Type Parallel
Minimum Operating Supply Voltage (V) 1.7
Typical Operating Supply Voltage (V) 1.8
Maximum Operating Supply Voltage (V) 1.95
Operating Current (mA) 20
Program Current (mA) 20
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Command Compatible Yes
ECC Support Yes
Support of Page Mode Yes
Mounting Surface Mount
Package Height 0.7(Max)
Package Width 9
Package Length 11
PCB changed 63
Standard Package Name BGA
Supplier Package VFBGA
Lead Shape Ball
Package Description TFBGA,
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Number of Words Code 128000000Words Codes
Package Body Material PLASTIC/EPOXY
Operating Temperature-Min -40 °C
Свойство продукта Значение свойства
Reflow Temperature-Max (s) NOT SPECIFIED
Access Time-Max 25000 ns
Operating Temperature-Max 85 °C
Rohs Code Yes
Manufacturer Part Number NAND01GR3B2CZA6F
Supply Voltage-Nom (Vsup) 1.8 V
Package Code TFBGA
Package Shape RECTANGULAR
Manufacturer STMicroelectronics
Part Life Cycle Code Transferred
Ihs Manufacturer STMICROELECTRONICS
Risk Rank 5.37
Part Package Code BGA
Packaging Tape and Reel
Part Status Obsolete
ECCN Code 3A991.B.1.A
HTS Code 8542.32.00.51
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Terminal Pitch 0.8 mm
Reach Compliance Code compliant
Pin Count 63
JESD-30 Code R-PBGA-B63
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.95 V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 1.7 V
Operating Mode ASYNCHRONOUS
Architecture Sectored
Organization 128MX8
Seated Height-Max 1.05 mm
Memory Width 8
Memory Density 1073741824 bit
Parallel/Serial PARALLEL
Memory IC Type FLASH
Programming Voltage 1.8 V
Sector Size 128Kbyte x 1024
Page Size 2Kbyte
Boot Block No
Width 9 mm
Length 11 mm
Просмотр сходства
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