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NAND08GAH0JZC5F Технические параметры

Micron Technology  NAND08GAH0JZC5F technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory
Марка Micron Technology
Surface Mount YES
Number of Terminals 153Terminals
Package Description FBGA, BGA153,14X14,20
Package Style GRID ARRAY, FINE PITCH
Package Body Material PLASTIC/EPOXY
Package Equivalence Code BGA153,14X14,20
Operating Temperature-Min -25 °C
Operating Temperature-Max 85 °C
Rohs Code Yes
Manufacturer Part Number NAND08GAH0JZC5F
Package Code FBGA
Package Shape SQUARE
Manufacturer Micron Technology Inc
Свойство продукта Значение свойства
Part Life Cycle Code Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC
Risk Rank 5.83
Subcategory Other Memory ICs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 0.5 mm
Reach Compliance Code unknown
JESD-30 Code S-PBGA-B153
Qualification Status Not Qualified
Power Supplies 1.8/3.3,3.3 V
Temperature Grade OTHER
Supply Current-Max 0.15 mA
Memory Density 8589934592 bit
Просмотр сходства
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