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NAND99W3M1BZBC5E Технические параметры

Micron Technology Inc  NAND99W3M1BZBC5E technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Specialized
Марка
Surface Mount YES
Number of Terminals 137Terminals
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC
Package Description FBGA, BGA137,10X15,32
Operating Temperature-Max 85 °C
Operating Temperature-Min -30 °C
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Equivalence Code BGA137,10X15,32
Package Shape RECTANGULAR
Свойство продукта Значение свойства
Package Style GRID ARRAY, FINE PITCH
Supply Voltage-Nom (Vsup) 3 V
ECCN Code EAR99
HTS Code 8542.32.00.71
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 0.8 mm
Reach Compliance Code compliant
JESD-30 Code R-PBGA-B137
Qualification Status Not Qualified
Temperature Grade OTHER
Memory IC Type MEMORY CIRCUIT
Mixed Memory Type FLASH+SDRAM
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NAND99W3M1BZBC5E Документы

  • Datasheets
NAND99W3M1BZBC5E brand manufacturers: Micron Technology Inc, Anli stock, NAND99W3M1BZBC5E reference price.Micron Technology Inc. NAND99W3M1BZBC5E parameters, NAND99W3M1BZBC5E Datasheet PDF and pin diagram description download.You can use the NAND99W3M1BZBC5E Specialized, DSP Datesheet PDF, find NAND99W3M1BZBC5E pin diagram and circuit diagram and usage method of function,NAND99W3M1BZBC5E electronics tutorials.You can download from the Anli.