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W3H128M72E-667SBM Технические параметры

Microsemi  W3H128M72E-667SBM technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory Cards
Марка Microsemi
ECCN (US) 4A994.a
Module DRAM Module
Module Density 1Gbyte
Number of Chip per Module 5Chip per Modules
Chip Density (bit) 1.8G
Data Bus Width (bit) 72
Max. Access Time (ns) 1.25
Maximum Clock Rate (MHz) 667
Chip Package Type PBGA
Minimum Operating Supply Voltage (V) 1.7
Typical Operating Supply Voltage (V) 1.8
Maximum Operating Supply Voltage (V) 1.9
Operating Current (mA) 1375
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 125
Свойство продукта Значение свойства
Supplier Temperature Grade Military
ECC Support Yes
Number of Chip Banks 8Chip Banks
CAS Latency 6
SPD EEPROM Support No
Supplier Package BGA
Mounting Surface Mount
Package Height 4.57(Max)
Package Length 22.1(Max)
Package Width 16.1(Max)
PCB changed 208
Part Status Active
Pin Count 208
Organization 128Mx72
PLL No
Self Refresh Yes
RoHS Status Supplier Unconfirmed
Просмотр сходства
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