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WEDPN16M64V-133B2M Технические параметры

Microsemi  WEDPN16M64V-133B2M technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory Cards
Марка Microsemi
Number of Chip per Module 4Chip per Modules
Chip Density (bit) 256M
Data Bus Width (bit) 64
Max. Access Time (ns) 6|5.5
Maximum Clock Rate (MHz) 133
Chip Configuration 16Mx16
Chip Package Type PBGA
Minimum Operating Supply Voltage (V) 3
Typical Operating Supply Voltage (V) 3.3
Maximum Operating Supply Voltage (V) 3.6
Operating Current (mA) 540
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 125
Supplier Temperature Grade Military
Module Sides Single
ECC Support No
Number of Chip Banks 4Chip Banks
Свойство продукта Значение свойства
CAS Latency 3|2
SPD EEPROM Support No
Supplier Package PBGA
Mounting Surface Mount
Package Height 2.03(Max)
Package Length 21.1(Max)
Package Width 21.1(Max)
PCB changed 219
Module Density 1Gbit
Module DRAM Module
ECCN (US) 4A994.a
Part Status Unconfirmed
Pin Count 219
Organization 16Mx64
PLL No
Refresh Cycles 8K
Self Refresh Yes
RoHS Status Supplier Unconfirmed

WEDPN16M64V-133B2M Документы

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