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A2F500M3G-1FGG256I Технические параметры

Microsemi Corporation  A2F500M3G-1FGG256I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - System On Chip (SoC)
Марка
Package / Case 256-LBGA
Surface Mount YES
Number of Pins 256Pins
Number of I/Os MCU - 25, FPGA - 66I/O
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series SmartFusion®
Published 2013
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256Terminations
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Supply Voltage 1.5V
Terminal Pitch 1mm
Frequency 100MHz
Time@Peak Reflow Temperature-Max (s) 30
Свойство продукта Значение свойства
Base Part Number A2F500M3G
Number of Outputs 66Outputs
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.575V
Power Supplies 1.51.82.53.3V
Supply Voltage-Min (Vsup) 1.425V
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture MCU, FPGA
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Number of Gates 500000Gates
Number of Logic Blocks (LABs) 24Logic Blocks (LABs)s
Primary Attributes ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Flash Size 512KB
Length 17mm
Height Seated (Max) 1.7mm
Width 17mm
RoHS Status RoHS Compliant
Lead Free Lead Free
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A2F500M3G-1FGG256I Документы

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