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APTC60TDUM35PG Технические параметры

Microsemi Corporation  APTC60TDUM35PG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Transistors - FETs, MOSFETs - Arrays
Марка
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Factory Lead Time 36 Weeks
Mount Chassis Mount, Screw
Mounting Type Chassis Mount
Package / Case SP6
Number of Pins 6Pins
Transistor Element Material SILICON
Number of Elements 6 Elements
Turn Off Delay Time 283 ns
Operating Temperature -40°C~150°C TJ
Packaging Bulk
Published 2006
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 21Terminations
ECCN Code EAR99
Terminal Finish TIN SILVER COPPER
Additional Feature AVALANCHE RATED
Max Power Dissipation 416W
Terminal Position UPPER
Terminal Form UNSPECIFIED
Свойство продукта Значение свойства
Pin Count 21
JESD-30 Code R-XUFM-X21
Configuration 3 BANKS, COMMON SOURCE, 2 ELEMENTS WITH BUILT-IN DIODE
Operating Mode ENHANCEMENT MODE
Power Dissipation 416W
Case Connection ISOLATED
Turn On Delay Time 21 ns
FET Type 6 N-Channel (3-Phase Bridge)
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 35m Ω @ 72A, 10V
Vgs(th) (Max) @ Id 3.9V @ 5.4mA
Input Capacitance (Ciss) (Max) @ Vds 14000pF @ 25V
Gate Charge (Qg) (Max) @ Vgs 518nC @ 10V
Rise Time 30ns
Drain to Source Voltage (Vdss) 600V
Fall Time (Typ) 84 ns
Continuous Drain Current (ID) 72A
Gate to Source Voltage (Vgs) 20V
Drain-source On Resistance-Max 0.035Ohm
Pulsed Drain Current-Max (IDM) 200A
Avalanche Energy Rating (Eas) 1800 mJ
FET Technology METAL-OXIDE SEMICONDUCTOR
FET Feature Standard
Radiation Hardening No
RoHS Status RoHS Compliant

APTC60TDUM35PG Документы

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