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M2S060-FGG676 Технические параметры

Microsemi Corporation  M2S060-FGG676 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - System On Chip (SoC)
Марка
Lifecycle Status IN PRODUCTION (Last Updated: 2 weeks ago)
Factory Lead Time 11 Weeks
Package / Case 676-BGA
Surface Mount YES
Number of I/Os 387I/Os
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series SmartFusion®2
Published 2015
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 676Terminations
Terminal Finish MATTE TIN
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Свойство продукта Значение свойства
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B676
Number of Outputs 387Outputs
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 387Inputs
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 60K Logic Modules
Number of Logic Cells 56520Logic Cells
Flash Size 256KB
Length 27mm
Height Seated (Max) 2.44mm
Width 27mm
RoHS Status RoHS Compliant
Просмотр сходства

M2S060-FGG676 Документы

M2S060-FGG676 brand manufacturers: Microsemi Corporation, Anli stock, M2S060-FGG676 reference price.Microsemi Corporation. M2S060-FGG676 parameters, M2S060-FGG676 Datasheet PDF and pin diagram description download.You can use the M2S060-FGG676 Embedded - System On Chip (SoC), DSP Datesheet PDF, find M2S060-FGG676 pin diagram and circuit diagram and usage method of function,M2S060-FGG676 electronics tutorials.You can download from the Anli.