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W3H32M72E-400SBM Технические параметры

Microsemi Corporation  W3H32M72E-400SBM technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory
Марка
Surface Mount YES
Material synthetic polyolefin
Number of Terminals 208Terminals
Diameter of protected wire (cable) 5.2…9.0 mm
Diameter before shrinkage 10.5 mm
Diameter after shrinkage 5.0 mm
Wall thickness before shrinkage 0.3 mm
Wall thickness after shrinkage 0.6 mm
Gross weight 1245.00
Transport packaging size/quantity 46*46*50/10
Part Life Cycle Code Transferred
Ihs Manufacturer MICROSEMI CORP
Package Description BGA, BGA208,11X19,40
Access Time-Max 0.6 ns
Clock Frequency-Max (fCLK) 200 MHz
Number of Words 33554432 wordsWord
Number of Words Code 32000000Words Codes
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA208,11X19,40
Package Shape RECTANGULAR
Package Style GRID ARRAY
Свойство продукта Значение свойства
Supply Voltage-Nom (Vsup) 1.8 V
Packaging spool 100 m
ECCN Code EAR99
Type Heat shrink tubing without adhesive
Color black
HTS Code 8542.32.00.36
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 1 mm
Reach Compliance Code compliant
JESD-30 Code R-PBGA-B208
Qualification Status Not Qualified
Working voltage 600 V
Temperature Grade MILITARY
Supply Current-Max 1.7 mA
Organization 32MX72
Output Characteristics 3-STATE
Memory Width 72
Operating temperature range -55…+125 °C
Standby Current-Max 0.035 A
Memory Density 2415919104 bit
I/O Type COMMON
Memory IC Type DDR DRAM MODULE
Shrink temperature +70…+120 °C
Refresh Cycles 8192
Shrink ratio 2 : 1
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W3H32M72E-400SBM Документы

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