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MCM63P737ZP166 Технические параметры

Motorola Mobility LLC  MCM63P737ZP166 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory
Марка
Surface Mount YES
Number of Terminals 119Terminals
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer MOTOROLA INC
Part Package Code BGA
Package Description BGA,
Access Time-Max 3.5 ns
Number of Words 131072 wordsWord
Number of Words Code 128000Words Codes
Operating Temperature-Max 70 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Supply Voltage-Nom (Vsup) 3.3 V
JESD-609 Code e0
ECCN Code 3A991.B.2.A
Terminal Finish TIN LEAD
Additional Feature PIPELINED ARCHITECTURE
Свойство продукта Значение свойства
HTS Code 8542.32.00.41
Terminal Position BOTTOM
Terminal Form BALL
Number of Functions 1Function
Terminal Pitch 1.27 mm
Reach Compliance Code unknown
Pin Count 119
JESD-30 Code R-PBGA-B119
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.465 V
Temperature Grade COMMERCIAL
Supply Voltage-Min (Vsup) 3.135 V
Operating Mode SYNCHRONOUS
Organization 128KX36
Seated Height-Max 2.4 mm
Memory Width 36
Memory Density 4718592 bit
Parallel/Serial PARALLEL
Memory IC Type CACHE SRAM
Length 22 mm
Width 14 mm
Просмотр сходства
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