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XPC755BRX300LE Технические параметры
Motorola Mobility LLC XPC755BRX300LE technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Embedded - Microprocessors | |
| Марка | ||
| Surface Mount | YES | |
| Number of Terminals | 360Terminals | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MOTOROLA INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Clock Frequency-Max | 100 MHz | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Supply Voltage-Max | 2.1 V | |
| Supply Voltage-Min | 1.8 V | |
| Supply Voltage-Nom | 2 V | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Terminal Position | BOTTOM |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Reach Compliance Code | unknown | |
| Pin Count | 360 | |
| JESD-30 Code | S-CBGA-B360 | |
| Qualification Status | Not Qualified | |
| Speed | 300 MHz | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC | |
| Bit Size | 32 | |
| Seated Height-Max | 3.2 mm | |
| Address Bus Width | 32 | |
| Boundary Scan | YES | |
| Low Power Mode | YES | |
| External Data Bus Width | 64 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| Length | 25 mm | |
| Width | 25 mm |
XPC755BRX300LE Документы
- DatasheetsMOTOS07946-1.pdf
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