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XPC860ENZP66C1 Технические параметры

Motorola Mobility LLC  XPC860ENZP66C1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - Microprocessors
Марка
Surface Mount YES
Number of Terminals 357Terminals
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer MOTOROLA INC
Part Package Code BGA
Package Description BGA, BGA357,19X19,50
Clock Frequency-Max 66 MHz
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA357,19X19,50
Package Shape SQUARE
Package Style GRID ARRAY
Supply Voltage-Max 3.465 V
Supply Voltage-Min 3.135 V
Supply Voltage-Nom 3.3 V
JESD-609 Code e0
Свойство продукта Значение свойства
ECCN Code 3A991.A.2
Terminal Finish TIN LEAD
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 1.27 mm
Reach Compliance Code unknown
Pin Count 357
JESD-30 Code S-PBGA-B357
Qualification Status Not Qualified
Speed 66 MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Bit Size 32
Seated Height-Max 2.05 mm
Address Bus Width 32
External Data Bus Width 32
Length 25 mm
Width 25 mm

XPC860ENZP66C1 Документы

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