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XPC755BRX300LB Технические параметры

Motorola Semiconductor Products  XPC755BRX300LB technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - Microprocessors
Марка
Surface Mount YES
Number of Terminals 360Terminals
Part Life Cycle Code Obsolete
Ihs Manufacturer MOTOROLA INC
Package Description BGA,
Clock Frequency-Max 300 MHz
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Supply Voltage-Max 2.1 V
Supply Voltage-Min 1.9 V
Supply Voltage-Nom 2 V
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Свойство продукта Значение свойства
Terminal Form BALL
Terminal Pitch 1.27 mm
Reach Compliance Code unknown
JESD-30 Code S-CBGA-B360
Qualification Status Not Qualified
Speed 300 MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Bit Size 32
Seated Height-Max 3.2 mm
Address Bus Width 32
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
Length 25 mm
Width 25 mm

XPC755BRX300LB Документы

  • Datasheets
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