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XPC860DPZP66D3 Технические параметры

Motorola Semiconductor Products  XPC860DPZP66D3 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - Microprocessors
Марка
Surface Mount YES
Number of Terminals 357Terminals
Part Life Cycle Code Obsolete
Ihs Manufacturer MOTOROLA INC
Package Description BGA, BGA357,19X19,50
Clock Frequency-Max 66 MHz
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA357,19X19,50
Package Shape SQUARE
Package Style GRID ARRAY
Supply Voltage-Max 3.465 V
Supply Voltage-Min 3.135 V
Supply Voltage-Nom 3.3 V
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Свойство продукта Значение свойства
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 1.27 mm
Reach Compliance Code unknown
JESD-30 Code S-PBGA-B357
Qualification Status Not Qualified
Speed 66 MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Bit Size 32
Seated Height-Max 2.05 mm
Address Bus Width 32
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Format FIXED POINT
Integrated Cache YES
Length 25 mm
Width 25 mm
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XPC860DPZP66D3 Документы

  • Datasheets
XPC860DPZP66D3 brand manufacturers: Motorola Semiconductor Products, Anli stock, XPC860DPZP66D3 reference price.Motorola Semiconductor Products. XPC860DPZP66D3 parameters, XPC860DPZP66D3 Datasheet PDF and pin diagram description download.You can use the XPC860DPZP66D3 Embedded - Microprocessors, DSP Datesheet PDF, find XPC860DPZP66D3 pin diagram and circuit diagram and usage method of function,XPC860DPZP66D3 electronics tutorials.You can download from the Anli.