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- UPD70F3033BGF-3BA-A
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UPD70F3033BGF-3BA-A Технические параметры
NEC UPD70F3033BGF-3BA-A technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Embedded - Microcontrollers | |
| Марка | NEC | |
| Mounting Type | Surface Mount | |
| Surface Mount | YES | |
| Number of Terminals | 100Terminals | |
| Mated Stacking Heights | 0.7mm | |
| Package Style | FLATPACK | |
| Moisture Sensitivity Levels | 4 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Equivalence Code | QFP100,.7X.9 | |
| Operating Temperature-Min | -40 °C | |
| Operating Temperature-Max | 85 °C | |
| Rohs Code | Yes | |
| Manufacturer Part Number | UPD70F3033BGF-3BA-A | |
| RAM(byte) | 16384 | |
| Package Code | QFP | |
| Package Shape | RECTANGULAR | |
| Manufacturer | Renesas Electronics Corporation | |
| ROM(word) | 65536 | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
| Risk Rank | 5.84 | |
| Series | WP7 | |
| Packaging | Tape & Reel (TR) | |
| JESD-609 Code | e6 |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Part Status | Active | |
| Connector Type | Plug, Outer Shroud Contacts | |
| Number of Positions | 70Positions | |
| Terminal Finish | Tin/Bismuth (Sn98Bi2) | |
| Number of Rows | 2Rows | |
| HTS Code | 8542.31.00.01 | |
| Subcategory | Microcontrollers | |
| Pitch | 0.016 (0.40mm) | |
| Technology | CMOS | |
| Terminal Position | QUAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.635 mm | |
| Reach Compliance Code | unknown | |
| Contact Finish | Gold | |
| JESD-30 Code | R-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| Power Supplies | 3.3/5,5 V | |
| Temperature Grade | INDUSTRIAL | |
| Speed | 20 MHz | |
| Bit Size | 32 | |
| CPU Family | V850 | |
| ROM Programmability | FLASH | |
| Features | Solder Retention | |
| Contact Finish Thickness | 3.90µin (0.099µm) | |
| Height Above Board | 0.020 (0.50mm) |
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