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BAS16J,135 Технические параметры
Nexperia USA Inc. BAS16J,135 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Diodes - Rectifiers - Single | |
| Марка | ||
| Factory Lead Time | 4 Weeks | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | SC-90, SOD-323F | |
| Number of Pins | 2Pins | |
| Diode Element Material | SILICON | |
| Number of Elements | 1 Element | |
| Packaging | Tape & Reel (TR) | |
| Series | Automotive, AEC-Q101, BAS16 | |
| JESD-609 Code | e3 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 2Terminations | |
| ECCN Code | EAR99 | |
| Terminal Finish | Tin (Sn) | |
| Max Operating Temperature | 150°C | |
| Min Operating Temperature | -65°C | |
| HTS Code | 8541.10.00.70 | |
| Max Power Dissipation | 550mW | |
| Terminal Position | DUAL | |
| Terminal Form | FLAT | |
| Peak Reflow Temperature (Cel) | 260 |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Base Part Number | BAS16J | |
| Pin Count | 2 | |
| Reference Standard | AEC-Q101; IEC-60134 | |
| Element Configuration | Single | |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) | |
| Diode Type | Standard | |
| Current - Reverse Leakage @ Vr | 500nA @ 80V | |
| Voltage - Forward (Vf) (Max) @ If | 1.25V @ 150mA | |
| Forward Current | 250mA | |
| Max Reverse Leakage Current | 30nA | |
| Operating Temperature - Junction | 150°C Max | |
| Max Surge Current | 4A | |
| Current - Average Rectified (Io) | 250mA DC | |
| Forward Voltage | 1.25V | |
| Max Reverse Voltage (DC) | 100V | |
| Average Rectified Current | 250mA | |
| Reverse Recovery Time | 4 ns | |
| Max Repetitive Reverse Voltage (Vrrm) | 100V | |
| Capacitance @ Vr, F | 1.5pF @ 0V 1MHz | |
| Peak Non-Repetitive Surge Current | 4A | |
| Recovery Time | 4 ns | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant |
BAS16J,135 Документы
- DatasheetsBAS16 Series Datasheet
- PCN Design/SpecificationBAS Data Sheet Update 22/Aug/2014 Bonding Wire Revision 28/Sep/2015
- PCN PackagingCarrier Tapes 31/Aug/2016 Pack/Label Update 30/Nov/2016
- ReachStatementNXP-Semiconductors-company-13.pdf
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